实例介绍
【实例简介】
STM32F302 STM32F303 的数据手册
STM32F302XX/STM32 F303XX Contents 3.16.4 Independent watchdog ..23 316.5 Window watchdog 3.16.6 Sys Tick timer 24 3.17 Real-time clock(RTC) and backup registers 25 3.18 C bus 25 3.19 Universal synchronous/asynchronous receiver transmitter(USART).. 26 3. 20 Universal asynchronous receiver transmitter(UART 27 3.21 Serial peripheral interface(SPI)/Inter-integrated sound interfaces(12S). 27 3. 22 Controller area network(CAN) ....28 3.23 Universal serial bus(USB) ·· 28 3.24 Infrared Transmitter 3. 25 Touch sensing controller (TSC) 29 3.26 Development support 31 3.26.1 Serial wire JTAG debug port (SWJ-DP) 3.26.2 Embedded trace macrocell m Pinouts and pin description.∴∴∴…………….….32 Memory mapping 50 6 Electrical characteristics 53 6.1 Parameter conditions ,53 6.1.1 Minimum and maximum values 53 6.1.2 Typical values .53 6.1. 3 Typical curves ......53 6.1. 4 Loading capacitor .,,53 6.1.5 Pin input voltage 53 6.1.6 Power supply scheme 6.1.7 Current consumption measurement 54 6.2 Absolute maximum ratings 56 6.3 Operating conditions 58 6.3.1 General operating conditions 58 6.3.2 Operating conditions at power-up/power-down 6.3. 3 Embedded reset and power control block characteristics 6.3.4 Embedded reference voltage 6.3.5 Supply current characteristics DoC D 023353 Rev 2 3/122 Contents STM32F302XX/STM32F303XX 6.3.6 External clock source characteristics .70 6.3.7 Internal clock source characteristics 76 6.3.8 PLL characteristics 6.3.9 Memory characteristics 6.3. 10 EMC characteristics 80 6.3.11 Electrical sensitivity characteristics 81 6.3.12 1 o current injection characteristics 82 6.3.13 10 port characteristics 6.3.14 NRST pin characteristics 90 6.3.15 Timer characteristics 91 6. 3.16 Communications interfaces ,,,,,93 6.3.17 ADC characteristics .102 6.3.18 DAC electrical specifications .,..106 6.3.19 Comparator characteristics .,,108 6.3.20 Operational amplifer charateristics 110 6.3.21 Temperature sensor characteristics 112 6.3.22 VBAT monitoring characteristics 112 Package characteristics 113 7.1 Package mechanical data ,,,,113 7.2 Thermal characteristics 117 72.1 Reference document 117 2.2 Selecting the product temperature range 118 Part numbering∴ 120 Revision history 121 4/122 DoC ID 023353 Rev 2 STM32F302XX/STM32 F303XX List of tables List of tables Table 1 Device summary Table 2. STM32F30x family device features and peripheral counts Table 3. Temperature sensor calibration values ,20 Table 4 Temperature sensor calibration values 20 Table 5 Timer feature comparison 22 Table 6. Comparison of 12C analog and digital filters 6 Table 7. STM32F30x IC implementation 26 Table 8. USART features ,,,27 Table 9. STM32F30X SP/2S implementation 28 Table 10. Capacitive sensing GPlOs available on STM32F30x devices 30 Table 11. No of capacitive sensing channels available on STM32F302XX/STM32F303XX devices. 30 Table 12. Legend/abbreviations used in the pinout table Table 13. STM32F302XX/STM32F303xx pin definitions 36 Table 14. Alternate functions for port A 42 Table 15. Alternate functions for port B 44 Table 16. Altenate functions for port c 6 Table 17. Alternate functions for port d ......47 Table 18. Alternate functions for port e 48 Table 19. Alternate functions for port F 49 Table 20. STM32F30x memory map and peripheral register boundary addresses 5 Table 21. Voltage characteristics 56 Table 22 Current characteristics 57 Table 23. Thermal characteristics ..57 Table 24. General operating conditions 58 Table 25. Operating conditions at power-up / power-down 59 Table 26. Embedded reset and power control block characteristics 59 Table 27. Programmable voltage detector characteristics 59 Table 28. Embedded internal reference voltage Table 29. Typical and maximum current consumption from VDp supply at VDD=3.6 V 62 Table 30. Typical and maximum current consumption from the VDDA supply 64 Table 31. Typical and maximum Vop consumption in Stop and Standby modes 65 Table 32. Typical and maximum VDDA consumption in Stop and Standby modes 65 Table 33. Typical and maximum current consumption from VBAT supply 66 Table 34. Typical current consumption in Run mode, code with data processing running from flash T able 35. Typical current consumption in Sleep mode, code running from Flash or RAM..... 68 Table 36. High-speed external user clock characteristics 70 Table 37. Low-speed external user clock characteristics ,,72 Table 38. Hse oscillator characteristics .,.,73 Table 39. LSE oscillator characteristics(fLSE 32.768 kHz) 75 Table 40. hsi oscillator characteristics ,,,76 Table 41. LSI oscillator characteristics Table 42. LoW-power mode wakeup timings 7 Table 43. Pll characteristics 78 Table 44. Flash memory characteristics 79 Table 45. Flash memory endurance and data retention 79 DoC D 023353 Rev 2 5/122 List of tables STM32F302XX/STM32F303XX Table 46. EMS characteristics .80 Table 47. EMi characteristics 81 Table 48. ESD absolute maximum ratings 81 Table 49. Electrical sensitivities 82 Table 50. l/0 current injection susceptibility ,83 Table 51. l/o static characteristics ..84 Table 52. Output voltage characteristics 88 Table 53. I/o ac characteristics 89 T able 54. NrsT pin characteristIcs 90 Table 55. TIMx characteristics Table 56. IWDG min/max timeout period at 40 kHz (LsI) 1 ,.,,.,,91 Table 57. WWDG min-max timeout value @72 MHz (PCLK) 92 Table 58, 2C characteristics 93 Table 59. 12C analog filter characteristics 93 Table 60. SPI characteristics 95 Table 61. |2s characteristics 98 Table 62. USB startup time Tabe63. USB DC electrical characteristics..………… 100 ....100 Table 64. USB: Full-speed electrical characteristics Table 65. Adc characteristics 102 Table 66. Minimum sampling time to be respected for fast and slow channels 103 Table 67 ADC accuracy .104 Table 68. DAc characteristics .106 Table 69. Comparator characteristics .108 Table 70. Operational amplifier characteristics ,.,,,.110 Table 71. TS characteristics 112 Table 72. VBAT monitoring characteristics 112 Table 73. LQPF100-14 X 14 mm, 100-pin low-profile quad flat package mechanical data 114 Table 74. LQFP64-10X 10 mm, 64-pin low-profile quad flat package mechanical data 15 Table 75. LQFP48-7x7 mm, 48-pin low-profile quad flat package mechanical data .,,116 Table 76. Package thermal characteristics Table 77. Ordering information scheme 120 Table 78. Document revision history 121 6/122 DoC ID 023353 Rev 2 STM32F302XX/STM32 F303XX List of figures List of figures Figure 1. STM32 F302XX block diagram Figure 2. STM32 F303xX block diagram Figure 3. Clock tree Figure 4. Infrared transmitter Figure 5. STM32F302XX/STM32 F303xX LQFP48 pinout Figure 6. STM32F302XX/STM32F303XX LQFP64 pinout 33 Figure 7. STM32F302XX/STM32 F303XX LQFP100 pinout ..,,.34 Figure 8 STM32F30x memory map 50 Figure 9. Pin loading conditions 53 Figure 10. Pin input voltage 53 Figure 11. Power supply scheme 54 Figure 12. Current consumption measurement scheme 54 Figure 13. High-speed external clock source AC timing diagram Figure 14. Low-speed external clock source AC timing diagram ,,,,,,,72 Figure 15. Typical application with an 8 MHz crystal 74 Figure 16. Typical application with a 32.768 kHz crystal 76 FIgure19. Five volt tolerant( FT and FTf) 1/0 input characteristics· CMOS po∴、∵ Figure 17. TC and TTa IO input characteristics-CMOS port 86 Figure 18. TC and TTa lO input characteristics-TTL port 86 .86 Figure 20. Five volt tolerant( FT and FTf)IO input characteristics- TTL port Figure 21. I/ AC characteristics definition .....90 Figure 22. Recommended NRST pin protection ....90 Figure 23. 12C bus AC waveforms and measurement circuit ,,,,,,,94 Figure 24. SPI timing diagram -slave mode and CPHA=0 96 Figure 25. SPI timing diagram- slave mode and CPHa= 1() 96 Figure 26. SPI timing diagram - master mode Figure 27. 12S slave timing diagram(Philips protocol)(T) 99 Figure 28. I"S master timing diagram( Philips protocol)(1) ,99 Figure 29. USB timings definition of data signal rise and fall time .100 Figure 30. ADC accuracy characteristics 104 Figure 31. Typical connection diagram using the ADC 105 Figure 32. 12-bit buttered /non-buffered DAC 107 Figure 33. LQFP100, 14 x 14 mm, 100-pin low-profile quad flat package outline 114 Figure 34. Recommended footprint( 1) 114 Figure 35. LQFP64-10x 10 mm, 64 pin low-profile quad flat package outline .,,,,115 Figure 36. Recommended footprint 115 Figure 37. LQFP48-7 7mm, 48-pin low-profile quad flat package outline. ....116 Figure 38. Recommended footprint(1) 116 Figure 3 9. LQFP100 Po max vs T A .119 DoC D 023353 Rev 2 7/122 Introduction STM32F302XX/STM32F303XX Introduction This datasheet provides the ordering information and mechanical device characteristics of the stM32F30x microcontrollers This STM32F30x datasheet should be read in conjunction with the sTM32F30x reference manual the reference manual is available from the stmicroelectronics website www.st.com For information on the Cortex TM-M4 F core please refer to the CorteXTM-M4F Technical ReferenceManual,availablefromthewww.arm.comwebsiteatthefollowingaddress http:/infocenter.arm.com/help/index.jsp?topic=/com.arm.doc.subset.cortexm.m4/index.html Cortex Intelligent Processors by ARM ARM: 8/122 DoC ID 023353 Rev 2 STM32F302XX/STM32 F303XX Description Description The STM32F302XX/STM32 F303xx family is based on the high-performance ARMe CortexTM-M4 32-bit RISC core operating at a frequency of up to 72 MHz, and embedding a floating point unit(FPU), a memory protection unit(MPU)and an embedded trace macrocell (ETM. The family incorporates high-speed embedded memories(up to 256 Kbytes of Flash memory, up to 48 Kbytes of SRAM), and an extensive range of enhanced lOs and peripherals connected to tWo APB buses The devices offer up to four fast 12-bit ADCS(5 Msps), up to seven comparators, up to four operational amplifiers, up to two DAC channels, a low-power RTC, up to five general- purpose 16-bit timers, one general-purpose 32-bit timer, and two timers dedicated to motor control. They also feature standard and advanced communication interfaces: up to two ICs up to three sPls(two SPls are with multiplexed full-duplex 12Ss on STM32F303xx devices) three USARTS, up to two UARTS CAN and USB. To achieve audio class accuracy, the 12S peripherals can be clocked via an external PLL The STM32F302XX/STM32F303xx family operates in the-40 to +85C and-40 to+105C temperature ranges from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications The STM32F302XX/STM32F303xx family offers devices in three packages ranging from 48 pins to 100 pins The set of included peripherals changes with the device chosen DoC D 023353 Rev 2 9/122 Description STM32F302XX/STM32F303XX Table 2 STM32F30x family device features and peripheral counts STM32F STM32F STM32F STM32F STM32F STM32F Peripheral 302cx 302RX 302vX 303cx 303RX 303vX Flash(kbytes) 128256128256128256128256128256128256 SRAM (Kbytes)on 243224322432324032403240 data bus sRAM(Kbytes)on nstruction bus(CCM core coupled memory) Advanced control 1(16-bit) 2(16bit) Timers General 5(16-bit) purpose 1 (32 bit Basic 1(16bit) 2(16-bi) SPI(12S) 3 2C 2 interfaces USART 3 UART 2 CAN USB Normal V/C 20 45 (TC, TTa 5 volts Tolerant 17 42 17 42 VOs (FT, Ftf) DMA channels 12 12-bit ADcs 4 12-bit dAc channels 2 Analog comparator 7 Operational amplifiers 2 CPU frequency 72 MHZ Operating voltage 2.0to3.6V Operating Ambient operating temperature: -40 to 85C/-40 to 105C temperature Junction temperature: -40 to 125C Packages LQFP48LQFP64 LQFP100LQFP48LOFP64LQFP100 1. In 128K and 256K Flash sTM32 F303xx devices the spi interfaces can work in an exclusive way in either the sPi mode or the l<s audio mode 10/122 DoC ID 023353 Rev 2 【实例截图】
【核心代码】
STM32F302 STM32F303 的数据手册
STM32F302XX/STM32 F303XX Contents 3.16.4 Independent watchdog ..23 316.5 Window watchdog 3.16.6 Sys Tick timer 24 3.17 Real-time clock(RTC) and backup registers 25 3.18 C bus 25 3.19 Universal synchronous/asynchronous receiver transmitter(USART).. 26 3. 20 Universal asynchronous receiver transmitter(UART 27 3.21 Serial peripheral interface(SPI)/Inter-integrated sound interfaces(12S). 27 3. 22 Controller area network(CAN) ....28 3.23 Universal serial bus(USB) ·· 28 3.24 Infrared Transmitter 3. 25 Touch sensing controller (TSC) 29 3.26 Development support 31 3.26.1 Serial wire JTAG debug port (SWJ-DP) 3.26.2 Embedded trace macrocell m Pinouts and pin description.∴∴∴…………….….32 Memory mapping 50 6 Electrical characteristics 53 6.1 Parameter conditions ,53 6.1.1 Minimum and maximum values 53 6.1.2 Typical values .53 6.1. 3 Typical curves ......53 6.1. 4 Loading capacitor .,,53 6.1.5 Pin input voltage 53 6.1.6 Power supply scheme 6.1.7 Current consumption measurement 54 6.2 Absolute maximum ratings 56 6.3 Operating conditions 58 6.3.1 General operating conditions 58 6.3.2 Operating conditions at power-up/power-down 6.3. 3 Embedded reset and power control block characteristics 6.3.4 Embedded reference voltage 6.3.5 Supply current characteristics DoC D 023353 Rev 2 3/122 Contents STM32F302XX/STM32F303XX 6.3.6 External clock source characteristics .70 6.3.7 Internal clock source characteristics 76 6.3.8 PLL characteristics 6.3.9 Memory characteristics 6.3. 10 EMC characteristics 80 6.3.11 Electrical sensitivity characteristics 81 6.3.12 1 o current injection characteristics 82 6.3.13 10 port characteristics 6.3.14 NRST pin characteristics 90 6.3.15 Timer characteristics 91 6. 3.16 Communications interfaces ,,,,,93 6.3.17 ADC characteristics .102 6.3.18 DAC electrical specifications .,..106 6.3.19 Comparator characteristics .,,108 6.3.20 Operational amplifer charateristics 110 6.3.21 Temperature sensor characteristics 112 6.3.22 VBAT monitoring characteristics 112 Package characteristics 113 7.1 Package mechanical data ,,,,113 7.2 Thermal characteristics 117 72.1 Reference document 117 2.2 Selecting the product temperature range 118 Part numbering∴ 120 Revision history 121 4/122 DoC ID 023353 Rev 2 STM32F302XX/STM32 F303XX List of tables List of tables Table 1 Device summary Table 2. STM32F30x family device features and peripheral counts Table 3. Temperature sensor calibration values ,20 Table 4 Temperature sensor calibration values 20 Table 5 Timer feature comparison 22 Table 6. Comparison of 12C analog and digital filters 6 Table 7. STM32F30x IC implementation 26 Table 8. USART features ,,,27 Table 9. STM32F30X SP/2S implementation 28 Table 10. Capacitive sensing GPlOs available on STM32F30x devices 30 Table 11. No of capacitive sensing channels available on STM32F302XX/STM32F303XX devices. 30 Table 12. Legend/abbreviations used in the pinout table Table 13. STM32F302XX/STM32F303xx pin definitions 36 Table 14. Alternate functions for port A 42 Table 15. Alternate functions for port B 44 Table 16. Altenate functions for port c 6 Table 17. Alternate functions for port d ......47 Table 18. Alternate functions for port e 48 Table 19. Alternate functions for port F 49 Table 20. STM32F30x memory map and peripheral register boundary addresses 5 Table 21. Voltage characteristics 56 Table 22 Current characteristics 57 Table 23. Thermal characteristics ..57 Table 24. General operating conditions 58 Table 25. Operating conditions at power-up / power-down 59 Table 26. Embedded reset and power control block characteristics 59 Table 27. Programmable voltage detector characteristics 59 Table 28. Embedded internal reference voltage Table 29. Typical and maximum current consumption from VDp supply at VDD=3.6 V 62 Table 30. Typical and maximum current consumption from the VDDA supply 64 Table 31. Typical and maximum Vop consumption in Stop and Standby modes 65 Table 32. Typical and maximum VDDA consumption in Stop and Standby modes 65 Table 33. Typical and maximum current consumption from VBAT supply 66 Table 34. Typical current consumption in Run mode, code with data processing running from flash T able 35. Typical current consumption in Sleep mode, code running from Flash or RAM..... 68 Table 36. High-speed external user clock characteristics 70 Table 37. Low-speed external user clock characteristics ,,72 Table 38. Hse oscillator characteristics .,.,73 Table 39. LSE oscillator characteristics(fLSE 32.768 kHz) 75 Table 40. hsi oscillator characteristics ,,,76 Table 41. LSI oscillator characteristics Table 42. LoW-power mode wakeup timings 7 Table 43. Pll characteristics 78 Table 44. Flash memory characteristics 79 Table 45. Flash memory endurance and data retention 79 DoC D 023353 Rev 2 5/122 List of tables STM32F302XX/STM32F303XX Table 46. EMS characteristics .80 Table 47. EMi characteristics 81 Table 48. ESD absolute maximum ratings 81 Table 49. Electrical sensitivities 82 Table 50. l/0 current injection susceptibility ,83 Table 51. l/o static characteristics ..84 Table 52. Output voltage characteristics 88 Table 53. I/o ac characteristics 89 T able 54. NrsT pin characteristIcs 90 Table 55. TIMx characteristics Table 56. IWDG min/max timeout period at 40 kHz (LsI) 1 ,.,,.,,91 Table 57. WWDG min-max timeout value @72 MHz (PCLK) 92 Table 58, 2C characteristics 93 Table 59. 12C analog filter characteristics 93 Table 60. SPI characteristics 95 Table 61. |2s characteristics 98 Table 62. USB startup time Tabe63. USB DC electrical characteristics..………… 100 ....100 Table 64. USB: Full-speed electrical characteristics Table 65. Adc characteristics 102 Table 66. Minimum sampling time to be respected for fast and slow channels 103 Table 67 ADC accuracy .104 Table 68. DAc characteristics .106 Table 69. Comparator characteristics .108 Table 70. Operational amplifier characteristics ,.,,,.110 Table 71. TS characteristics 112 Table 72. VBAT monitoring characteristics 112 Table 73. LQPF100-14 X 14 mm, 100-pin low-profile quad flat package mechanical data 114 Table 74. LQFP64-10X 10 mm, 64-pin low-profile quad flat package mechanical data 15 Table 75. LQFP48-7x7 mm, 48-pin low-profile quad flat package mechanical data .,,116 Table 76. Package thermal characteristics Table 77. Ordering information scheme 120 Table 78. Document revision history 121 6/122 DoC ID 023353 Rev 2 STM32F302XX/STM32 F303XX List of figures List of figures Figure 1. STM32 F302XX block diagram Figure 2. STM32 F303xX block diagram Figure 3. Clock tree Figure 4. Infrared transmitter Figure 5. STM32F302XX/STM32 F303xX LQFP48 pinout Figure 6. STM32F302XX/STM32F303XX LQFP64 pinout 33 Figure 7. STM32F302XX/STM32 F303XX LQFP100 pinout ..,,.34 Figure 8 STM32F30x memory map 50 Figure 9. Pin loading conditions 53 Figure 10. Pin input voltage 53 Figure 11. Power supply scheme 54 Figure 12. Current consumption measurement scheme 54 Figure 13. High-speed external clock source AC timing diagram Figure 14. Low-speed external clock source AC timing diagram ,,,,,,,72 Figure 15. Typical application with an 8 MHz crystal 74 Figure 16. Typical application with a 32.768 kHz crystal 76 FIgure19. Five volt tolerant( FT and FTf) 1/0 input characteristics· CMOS po∴、∵ Figure 17. TC and TTa IO input characteristics-CMOS port 86 Figure 18. TC and TTa lO input characteristics-TTL port 86 .86 Figure 20. Five volt tolerant( FT and FTf)IO input characteristics- TTL port Figure 21. I/ AC characteristics definition .....90 Figure 22. Recommended NRST pin protection ....90 Figure 23. 12C bus AC waveforms and measurement circuit ,,,,,,,94 Figure 24. SPI timing diagram -slave mode and CPHA=0 96 Figure 25. SPI timing diagram- slave mode and CPHa= 1() 96 Figure 26. SPI timing diagram - master mode Figure 27. 12S slave timing diagram(Philips protocol)(T) 99 Figure 28. I"S master timing diagram( Philips protocol)(1) ,99 Figure 29. USB timings definition of data signal rise and fall time .100 Figure 30. ADC accuracy characteristics 104 Figure 31. Typical connection diagram using the ADC 105 Figure 32. 12-bit buttered /non-buffered DAC 107 Figure 33. LQFP100, 14 x 14 mm, 100-pin low-profile quad flat package outline 114 Figure 34. Recommended footprint( 1) 114 Figure 35. LQFP64-10x 10 mm, 64 pin low-profile quad flat package outline .,,,,115 Figure 36. Recommended footprint 115 Figure 37. LQFP48-7 7mm, 48-pin low-profile quad flat package outline. ....116 Figure 38. Recommended footprint(1) 116 Figure 3 9. LQFP100 Po max vs T A .119 DoC D 023353 Rev 2 7/122 Introduction STM32F302XX/STM32F303XX Introduction This datasheet provides the ordering information and mechanical device characteristics of the stM32F30x microcontrollers This STM32F30x datasheet should be read in conjunction with the sTM32F30x reference manual the reference manual is available from the stmicroelectronics website www.st.com For information on the Cortex TM-M4 F core please refer to the CorteXTM-M4F Technical ReferenceManual,availablefromthewww.arm.comwebsiteatthefollowingaddress http:/infocenter.arm.com/help/index.jsp?topic=/com.arm.doc.subset.cortexm.m4/index.html Cortex Intelligent Processors by ARM ARM: 8/122 DoC ID 023353 Rev 2 STM32F302XX/STM32 F303XX Description Description The STM32F302XX/STM32 F303xx family is based on the high-performance ARMe CortexTM-M4 32-bit RISC core operating at a frequency of up to 72 MHz, and embedding a floating point unit(FPU), a memory protection unit(MPU)and an embedded trace macrocell (ETM. The family incorporates high-speed embedded memories(up to 256 Kbytes of Flash memory, up to 48 Kbytes of SRAM), and an extensive range of enhanced lOs and peripherals connected to tWo APB buses The devices offer up to four fast 12-bit ADCS(5 Msps), up to seven comparators, up to four operational amplifiers, up to two DAC channels, a low-power RTC, up to five general- purpose 16-bit timers, one general-purpose 32-bit timer, and two timers dedicated to motor control. They also feature standard and advanced communication interfaces: up to two ICs up to three sPls(two SPls are with multiplexed full-duplex 12Ss on STM32F303xx devices) three USARTS, up to two UARTS CAN and USB. To achieve audio class accuracy, the 12S peripherals can be clocked via an external PLL The STM32F302XX/STM32F303xx family operates in the-40 to +85C and-40 to+105C temperature ranges from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications The STM32F302XX/STM32F303xx family offers devices in three packages ranging from 48 pins to 100 pins The set of included peripherals changes with the device chosen DoC D 023353 Rev 2 9/122 Description STM32F302XX/STM32F303XX Table 2 STM32F30x family device features and peripheral counts STM32F STM32F STM32F STM32F STM32F STM32F Peripheral 302cx 302RX 302vX 303cx 303RX 303vX Flash(kbytes) 128256128256128256128256128256128256 SRAM (Kbytes)on 243224322432324032403240 data bus sRAM(Kbytes)on nstruction bus(CCM core coupled memory) Advanced control 1(16-bit) 2(16bit) Timers General 5(16-bit) purpose 1 (32 bit Basic 1(16bit) 2(16-bi) SPI(12S) 3 2C 2 interfaces USART 3 UART 2 CAN USB Normal V/C 20 45 (TC, TTa 5 volts Tolerant 17 42 17 42 VOs (FT, Ftf) DMA channels 12 12-bit ADcs 4 12-bit dAc channels 2 Analog comparator 7 Operational amplifiers 2 CPU frequency 72 MHZ Operating voltage 2.0to3.6V Operating Ambient operating temperature: -40 to 85C/-40 to 105C temperature Junction temperature: -40 to 125C Packages LQFP48LQFP64 LQFP100LQFP48LOFP64LQFP100 1. In 128K and 256K Flash sTM32 F303xx devices the spi interfaces can work in an exclusive way in either the sPi mode or the l<s audio mode 10/122 DoC ID 023353 Rev 2 【实例截图】
【核心代码】
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