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nxp5744芯片数据手册(MPC5744P.pdf)

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  • 开发语言:C/C++
  • 实例大小:1.73M
  • 下载次数:15
  • 浏览次数:1262
  • 发布时间:2020-12-29
  • 实例类别:嵌入式开发
  • 发 布 人:huaita.wan
  • 文件格式:.pdf
  • 所需积分:2
 相关标签: 芯片 NXP 数据 手册

实例介绍

【实例简介】nxpMPC5744芯片数据手册

【实例截图】

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【核心代码】

Table of Contents
1 Introduction.......................................................................................... 3
1.1 Features......................................................................................3
1.2 Block Diagram...........................................................................5
2 Pinouts..................................................................................................6
2.1 Package pinouts and ballmap.................................................... 6
2.2 Pin/ball descriptions ................................................................. 8
2.2.1 Pin/ball startup and reset states................................. 8
2.2.2 Power supply and reference voltage pins/balls......... 9
2.2.3 System pins/balls.......................................................12
2.2.4 LVDS pins/balls........................................................13
2.2.5 Generic pins/balls......................................................14
2.2.6 Peripheral input muxing............................................43
3 Electrical characteristics.......................................................................55
3.1 Introduction............................................................................... 55
3.2 165°C junction temperature option........................................... 55
3.3 Absolute maximum ratings....................................................... 55
3.4 Recommended operating conditions......................................... 57
3.5 Thermal characteristics..............................................................58
3.5.1 General notes for specifications at maximum
junction temperature................................................. 59
3.6 Electromagnetic compatibility (EMC)...................................... 60
3.7 Electrostatic discharge (ESD) characteristics............................62
3.8 Voltage regulator electrical characteristics............................... 62
3.9 DC electrical characteristics......................................................65
3.10 Supply current characteristics....................................................67
3.11 Temperature sensor................................................................... 69
3.12 Main oscillator electrical characteristics................................... 69
3.13 PLLDIG electrical characteristics............................................. 72
3.14 16 MHz Internal RC Oscillator (IRCOSC) electrical
specifications............................................................................. 73
3.15 ADC electrical characteristics................................................... 74
3.16 Flash memory specifications..................................................... 77
3.16.1 Maximum junction temperature 150°C.....................77
3.16.2 Maximum junction temperature 165°C.....................80
3.16.3 Flash memory read wait-state and address-pipeline
control settings.......................................................... 84
3.17 SGEN electrical characteristics................................................. 85
3.18 RESET sequence duration.........................................................86
3.19 AC specifications.......................................................................86
3.19.1 Reset pad (EXT_POR, RESET) electrical
characteristics............................................................87
3.19.2 WKUP/NMI timing...................................................89
3.19.3 Debug/JTAG/Nexus/Aurora timing..........................89
3.19.4 External interrupt timing (IRQ pin).......................... 96
3.19.5 SPI timing................................................................. 97
3.19.6 LFAST...................................................................... 102
3.19.7 FlexRay..................................................................... 106
3.19.8 Ethernet switching specifications..............................109
4 Obtaining package dimensions.............................................................111
5 Ordering information............................................................................112
6 Document revision history................................................................... 113

标签: 芯片 NXP 数据 手册

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nxp5744芯片数据手册(MPC5744P.pdf)

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