实例介绍
【实例简介】
The Mobile PCI Express Module (MXM) is a standard graphics interface for PCI Express fi systems.
Revision History Rev Resp Change 1.0 GG Initial release Contents 1 Introduction 1. 1 Background 1.2 MXM Version 3.0 Benefits 1.3 Display Sup 11234 1.4 Required Optional Feature Matrix 2 Mechanical Specification 5 2.1 Form Factors 2.2 MXM Board Outlines 2.3 MXM PCB Mounting Holes 2.3.1 Board Mounting holes 2.3.2 Thermal Solution mountin 23.3 Backing plate· 77779 4 Board Height Restrictions 2.5 MXM Edge Fingers 14 2.6 MXM Connector 3 Electrical Specifications 23 3.1 Electrical Connector 3.2 Connector pinout 3.3 Pin de 28 3.3.1 Power Group 28 3.3.2 PCI Express signal 3.3.3 Display Port Signal Group 30 3.3.4 LVDS Signal gt p 3.3.5 Analog Display Signal Group 32 3.3.6 Power and Thermal Management Signal Group 3.3.7 System Management Signal Group 34 3.4 System Requirements 3.4.1 Power Sequencing 3.4.2 Module Powet Down and Power Up 36 3.4.3 Reset requirements 36 3.4.4 PCI Express Interface 3.4.5 Display port Interface 3.4.6 DVI/HDMI on DP Interface 38 3.4.7 DVI/HDMI on I VDS Interface 39 3.4.8 VGA Interface 3.4.9 TV Out Imple 40 3.4.10 SMBus interface 3.4.11 Thermal and Power Management Interface 41 3.4.12 PWR_LEVEL Signal 3.4.13 Internal Flat Panel Interface 42 3.4.14 VGA DISABLE# Signal 42 3.4.15 WAKE Functionality 42 3.4.16 OEM Modules 42 3.5 Signal Integrity 43 3.5.1 Module Specification 3.5.2 System Specitication 44 3.5.3 Displayport 3.5.4 TMDS and Lvds 47 5.5 PCI Express 3.6 DC Specifications 50 4 Thermal specification 51 4.1 Thermal fication philosoph 5 4.1.1S 4.1.2 Power sot 4.2 Thermal Requirements 53 4. 2. 1 System Requirements 4.2.2 Module Thermal requirements 4.2.3 Thermal Solution Rcquirements 4.3 Thermal Specification Summarv Applicable Documents 61 List of Figures 1.1 MXMA pplIcations... 1.2 MXM Compatibility 2.1 Board outlines 2.2 Board Slots detail 2. 3 Mounting Holes(lype A and ' ype B) 26789 2.4 Board Bottom Side Height Restrictions (Type A and Type B) 2.5 Type A Top Side Height restrictions 11 2.6 Type B Top Side Height Restrictions 2.7 Card Thickness and Chamfer 14 2.8 Module edge finger to 2.9 Module Edge Finger Bottom 17 2.10 Pin Alignment Detail 18 2.11 Terminal- Board Minimum engagement 2.12 Connector Footprint 20 2.13 Module location 3.1 Connector Differential Insertion loss 24 3.2 Connector Differential Return Loss 24 3.3 Connector Differential Near End Cross talk 3.4 Power Sequencing 3.5 Module power down 3.6 Reset Sequencing 36 3.7 Dual-mode displayport Implementation 3.8 DVI/HDMI Implementation using DP Interface 38 3.9 VGA Implementation 39 3.10 TV Implementation 3.11 Internal Flat Panel Timing 42 3.12 MXM Module and System 3.13 Module Validation Test Setup 43 3.14 System Validation Test Setup Display Interfaces 44 3.15 System Validation Test Setup(PCle Interface) 44 3.16 Display port hBr TP MXM Eye Diagram 45 3. 18 System Board Insertion and Return Loss Requirements for display Port.,...... 45 3.17 Display Port RBR TP_MXM Eye Diagram 46 3.19 TMDS TP_MXM Eye Diagram 47 3.20 LVDS TP_MXM Eye Diagram 47 3.21 System Board Insertion an Return Loss Requirements for IMDS 48 Mobile PCI Express Module Electromechanical Specification V 3.0 3. 22 MXM Module Transmitter Path Compliance Eye Diagram 3. 23 System Board Transmitter Path Compliance Eye Diagram 4.1 MXM Thermal Compatibilit 4. 2 MXM SyStem Thermal Components 52 4.3 Iype A and'l'ype B AmbientTemperature Measurement Locations 54 4.4 Type A Thermal Zones 4.5 Type B Thermal Zones List of tables 1.1 Required and Optional Display Support 1.2 Required and Optional Feature matrix 4 2.1 Board Outline dimensions 2.2 Board Slot Dimensions 7 2.3 Mounting Holes Dimensions 8 2.4 Board Bottom Side dimensions 10 Type A Top Side Dimensions 12 2.6 Type B Top Side Dimensions 12 2.7 Card Thickness and Chamfer Dimensions 14 2.8 Module Edge finger Top Dimensions 2.9 Module Edge Finger Bottom Dimensions 16 2.10 Pin Alignment Dimensions 2.11 Terminal-Board Minimum Engage ement dimensions 2.12 Connector Footprint Dimensions 0 2. 13 Connector Mechanical Performance requirements 3.1 MXM Connector Electrical Performance requirements 3.2 Connector pinout 26 3.3 Connector Pinout(continued) 3.4 Signal Types 28 3.5 MXM Power rails 28 3.6 Connector Pin Description(PCle group) 3.7 Connector Pin Description DP group) 30 3.8 Connector Pin Description (LVDS Group) 3.9 Connector Pin Description(Analog Display Group 32 3.10 Connector Pin Description Power and Thermal Management Group 33 3.11 Connector Pin Description(System Management Group 3. 12 Signals Exempted from Gating Requirement 3.13 Display port multiplexed Signal Definition 38 3.14 LVDS Multi Function Signal Definition 39 3.15 Module smbus address 3.16 TP MXM CBB Specification 43 17 MXM CLB Specification 44 3.18 LB Specification 3.19 CMOS and Open Drain Signals DC Specifications 50 4.1 MXM Assumptions on Power Distribution 52 Mobile PCI Express Module Electromechanical Specification V3.0 4.2 Ambient Temperature Specification 4.3 Ambient Temperature Measurement Locations Dimensions 4.5 Thermal Solution Spreader Bottom Side Profile Step Requirements 4.4 Maximum Spreader Plate Temperatures 56 4.6 Type A Thermal Zones Dimensions 57 4.7 Type B Thermal Zones Dimensions 4.8 Thermal Specification Summarv 【实例截图】
【核心代码】
The Mobile PCI Express Module (MXM) is a standard graphics interface for PCI Express fi systems.
Revision History Rev Resp Change 1.0 GG Initial release Contents 1 Introduction 1. 1 Background 1.2 MXM Version 3.0 Benefits 1.3 Display Sup 11234 1.4 Required Optional Feature Matrix 2 Mechanical Specification 5 2.1 Form Factors 2.2 MXM Board Outlines 2.3 MXM PCB Mounting Holes 2.3.1 Board Mounting holes 2.3.2 Thermal Solution mountin 23.3 Backing plate· 77779 4 Board Height Restrictions 2.5 MXM Edge Fingers 14 2.6 MXM Connector 3 Electrical Specifications 23 3.1 Electrical Connector 3.2 Connector pinout 3.3 Pin de 28 3.3.1 Power Group 28 3.3.2 PCI Express signal 3.3.3 Display Port Signal Group 30 3.3.4 LVDS Signal gt p 3.3.5 Analog Display Signal Group 32 3.3.6 Power and Thermal Management Signal Group 3.3.7 System Management Signal Group 34 3.4 System Requirements 3.4.1 Power Sequencing 3.4.2 Module Powet Down and Power Up 36 3.4.3 Reset requirements 36 3.4.4 PCI Express Interface 3.4.5 Display port Interface 3.4.6 DVI/HDMI on DP Interface 38 3.4.7 DVI/HDMI on I VDS Interface 39 3.4.8 VGA Interface 3.4.9 TV Out Imple 40 3.4.10 SMBus interface 3.4.11 Thermal and Power Management Interface 41 3.4.12 PWR_LEVEL Signal 3.4.13 Internal Flat Panel Interface 42 3.4.14 VGA DISABLE# Signal 42 3.4.15 WAKE Functionality 42 3.4.16 OEM Modules 42 3.5 Signal Integrity 43 3.5.1 Module Specification 3.5.2 System Specitication 44 3.5.3 Displayport 3.5.4 TMDS and Lvds 47 5.5 PCI Express 3.6 DC Specifications 50 4 Thermal specification 51 4.1 Thermal fication philosoph 5 4.1.1S 4.1.2 Power sot 4.2 Thermal Requirements 53 4. 2. 1 System Requirements 4.2.2 Module Thermal requirements 4.2.3 Thermal Solution Rcquirements 4.3 Thermal Specification Summarv Applicable Documents 61 List of Figures 1.1 MXMA pplIcations... 1.2 MXM Compatibility 2.1 Board outlines 2.2 Board Slots detail 2. 3 Mounting Holes(lype A and ' ype B) 26789 2.4 Board Bottom Side Height Restrictions (Type A and Type B) 2.5 Type A Top Side Height restrictions 11 2.6 Type B Top Side Height Restrictions 2.7 Card Thickness and Chamfer 14 2.8 Module edge finger to 2.9 Module Edge Finger Bottom 17 2.10 Pin Alignment Detail 18 2.11 Terminal- Board Minimum engagement 2.12 Connector Footprint 20 2.13 Module location 3.1 Connector Differential Insertion loss 24 3.2 Connector Differential Return Loss 24 3.3 Connector Differential Near End Cross talk 3.4 Power Sequencing 3.5 Module power down 3.6 Reset Sequencing 36 3.7 Dual-mode displayport Implementation 3.8 DVI/HDMI Implementation using DP Interface 38 3.9 VGA Implementation 39 3.10 TV Implementation 3.11 Internal Flat Panel Timing 42 3.12 MXM Module and System 3.13 Module Validation Test Setup 43 3.14 System Validation Test Setup Display Interfaces 44 3.15 System Validation Test Setup(PCle Interface) 44 3.16 Display port hBr TP MXM Eye Diagram 45 3. 18 System Board Insertion and Return Loss Requirements for display Port.,...... 45 3.17 Display Port RBR TP_MXM Eye Diagram 46 3.19 TMDS TP_MXM Eye Diagram 47 3.20 LVDS TP_MXM Eye Diagram 47 3.21 System Board Insertion an Return Loss Requirements for IMDS 48 Mobile PCI Express Module Electromechanical Specification V 3.0 3. 22 MXM Module Transmitter Path Compliance Eye Diagram 3. 23 System Board Transmitter Path Compliance Eye Diagram 4.1 MXM Thermal Compatibilit 4. 2 MXM SyStem Thermal Components 52 4.3 Iype A and'l'ype B AmbientTemperature Measurement Locations 54 4.4 Type A Thermal Zones 4.5 Type B Thermal Zones List of tables 1.1 Required and Optional Display Support 1.2 Required and Optional Feature matrix 4 2.1 Board Outline dimensions 2.2 Board Slot Dimensions 7 2.3 Mounting Holes Dimensions 8 2.4 Board Bottom Side dimensions 10 Type A Top Side Dimensions 12 2.6 Type B Top Side Dimensions 12 2.7 Card Thickness and Chamfer Dimensions 14 2.8 Module Edge finger Top Dimensions 2.9 Module Edge Finger Bottom Dimensions 16 2.10 Pin Alignment Dimensions 2.11 Terminal-Board Minimum Engage ement dimensions 2.12 Connector Footprint Dimensions 0 2. 13 Connector Mechanical Performance requirements 3.1 MXM Connector Electrical Performance requirements 3.2 Connector pinout 26 3.3 Connector Pinout(continued) 3.4 Signal Types 28 3.5 MXM Power rails 28 3.6 Connector Pin Description(PCle group) 3.7 Connector Pin Description DP group) 30 3.8 Connector Pin Description (LVDS Group) 3.9 Connector Pin Description(Analog Display Group 32 3.10 Connector Pin Description Power and Thermal Management Group 33 3.11 Connector Pin Description(System Management Group 3. 12 Signals Exempted from Gating Requirement 3.13 Display port multiplexed Signal Definition 38 3.14 LVDS Multi Function Signal Definition 39 3.15 Module smbus address 3.16 TP MXM CBB Specification 43 17 MXM CLB Specification 44 3.18 LB Specification 3.19 CMOS and Open Drain Signals DC Specifications 50 4.1 MXM Assumptions on Power Distribution 52 Mobile PCI Express Module Electromechanical Specification V3.0 4.2 Ambient Temperature Specification 4.3 Ambient Temperature Measurement Locations Dimensions 4.5 Thermal Solution Spreader Bottom Side Profile Step Requirements 4.4 Maximum Spreader Plate Temperatures 56 4.6 Type A Thermal Zones Dimensions 57 4.7 Type B Thermal Zones Dimensions 4.8 Thermal Specification Summarv 【实例截图】
【核心代码】
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