实例介绍
【实例简介】
RF Measurement of Die and Package good book for RF calibration and Debedding
Library of Congress Cataloging-in-Publication Data Wartenberg, Scott A. RF measurements of die and packages/ Scott A. Wartenberg Includes bibliographical references and inder: ry) cm (Artech House microwave librar ISBN 1-58053-273-x(alk. paper) 1. Very high speed integrated circuits-Measurements. 2. Integrated circuits -Masks--Design and construction. 3. Microelectronic packaging. 4. Radio measurements. I. Title TK787±.7.W372002 6213815dc21 2002016431 Contents British Library Cataloguing in Publication Data Wartenberg, Scott A RF measurements of die and packages.--(Artech House microwave library 1. Integrated circuits--Testing 2 Radio circuits--Testing 3 Preface ( Electronic instruments) Reference I. title 6213815 Acknowledgments ISBN1-58053-273x Introduction Cover design by Yekaterina Ratner Topics covered in This book 1.1.1 Calibration 1.1.2 Coplanar Probes 1.1.3 High-Volume Probing C 2002 ARTECH HOUSE, ING 685 Canton Street 1. 14 Test fixtures Norwood, MA 02062 1. 1. 5 On-Wafer Characterization 1.1.6 RF Test Systems rights reserved. Printed and bound in the United States of America. No part of this book 1.1.7 Package Charactcrization 2224444 may be reproduced or utilized in any form or by any means, electronic or mechanical, in- cluding photocopying, recording, or by any information storage and retrieval system, with Components of an RF Test System out permission in writing from the publisher 1.2.1 VNA All terms mentioned in this book that are known to be trademarks or service marks have been appropriately capitalized. Artech House cannot attest to the accuracy of this informa 1. 2.2 LCR Meter 4.57 tion. Use of a term in this book should not be regarded as affecting the validity of any trade 1. 2.3 RF cables mark or service mark International Standard Book Number: 1-58053-273 Library of Congress Catalog Card Number: 2002016431 098765432 RF Measurements of Die and Packages C ontents 1. 2. 4 Bias Cables 2.6.5 LRRM 1.2.5 Bias Tccs 10 2.7. Verification RF Connectors 2.7.1 Verification Elements 4生 1.3.1 Connector Types 2.7.2 Verifying with a Reference or"Golden"Unit 45 1.3.2 Making the Connection 2.8 Isolation 45 1.3.3 Connector Carc 12 2.9 Traceabilit 1.4 RF Connector Adapters 12 2.10 Repeatability, Reproducibility, and accuracy 15 The probe station 12 2.11 Calibration Tips and Tricks 1. 6 Summary 13 References 2. 12 Summary 51 Calibration Coplanar Probes 55 2. 1 Test System Errors: Random or Systematic 15 3.1 Theory of CPW 2.2 Concept of a Reference Plane 16 32 Mechanical Construction Error models 17 3.3 quivalent circuit 58 2.3.1 Signal Flow Graph 9 2.3.2 Error Adapter 21 3.4 Characterizing a Coplanar Probe 2,4 Calibration standards 3.5 Using Coplanar Probes 2, 4.1 Calibration Coefficients 24 3.5.1 Planarization 2.4.2 Short 3.5.2 Alignment 2.4.3. Open 26 3.5.3Ska 2.4.4 Load 28 3.54Ce Cleaning 2.4.5 Thru 29 3.6 Probe Configurations 2.5 Improving the Standard 3.6. 1 Balanced 2.5.1 Offset Delay 31 3.6.2 Unbalanced 6666 2.5.2 Offset Loss 3.6.3 Differential 3.6. 4 Other Probe Configurations Calibration method 33 2,61 SOLT 35 Noncontact Probing 71 2.6.2 SOLR 37 3.8 Applications 72 2.6.3 TRL 38 3.8.1 Millimeter-Wave Probing 72 2.64 LRM 3.8.2 Impedance-Matching, Low-Impedance Probes RF Measurements of Die and Packages Contents Coplanar Probe Calibration Standards 52 RF Transitions 3.9.1 Alumina Calibration Substrate 5.2.1 Coaxial to Microstrip 100 3.9.2 On-Wafer Calibration Standards 76 5.2.2 CPW to Microstrip 102 3.9.3 Open: In the Air or on Open Pads 77 5.2.3 Rectangular Waveguide to CPW 3.9.4 More Design Tips 5.2.4 Rectangular Waveguide to Microstrip 104 3.9.5 Verification 5.2.5 Rectangular Waveguide to Coaxial 105 3.10 Summary 80 5.3 Defining the Reference Planes 105 References 80 5.4 Two-Tier Calibration 107 High-Volume Probing 5.5 Test Fixture Calibration 108 5.5.1 Calibration Standards: Coaxial Versus In-Fixture 108 4.1 High-Volume Test 5.5.2 Calibration Method 109 RF Probe Card 84 5.5.3 Calibration Phase Uncertainty 111 4.21· Load B oard 4.2.2 Probe board 5.6 Summary 112 References 112 4.2. 3 Contactor Membrane probe On-Wafer Characterization 115 4.3.1 Construction 6. 1 Conductive Versus Insulating Substrates 116 4.4 Designing Membrane Probes 4.4.1 Digital and RF Signals Probe Pads and Interconnecting lines 118 4.4.2 Grounding 90 De-embedding the pads and interconnects 118 4.5 Using Membrane Probes 6.3.1 Open 119 6.3.2 Open and Short 4.6 Calibration 6.3.3 Open, Short, and Thru 122 4.7 Summary 6.3.4 Two-Port nctwork with a thru References 93 6.3.5 Two Shorts, an Open, and a thru 124 6.3.6 Some points to Consider When De-embeddin 126 5 Test Fixtures 6.3.7 Should the Transistor Finger Metal Be De-embedded? 128 5.1 The Basic test fixture 95 6.3.8 Effect of Pad Parasitics on ft 129 5. 1.1 Qualities of a Good Test Fixture 97 6. 4 De-embedding pads for noise 131 5.1.2 Characterizing the Fixture's Parasitic Effects 5.1.3 Types of Fixtures: R&D or Manufacturing 98 6.5 Measuring High-Isolation Devices 5. 1.4 Fixturing for Passive Components 6.6 Characterizing vertical devices 136 5.1.5 Fixturing for Active Components 99 6.7 Characterizing Passive Components 138 RF Measurements of Die and Packages orient 6.8 Millimeter-Wave Characterization 138 6.5.2 Time-Domain analysis 176 69 140 8.5.3 How to Apply Time-Domain Techniques Summary References 141 8.6 Procedure for Characterizing a Packa 6.1 Cha 182 RF Test Systems 145 8.6.2 Characterizing with a Short 183 8.6.3 Characterizing with an Open 7.1 On-Wafer noise te 145 8.6.4 Cha with a load 183 7.1.1 Basic Concepts in Noise 145 8.6.5 Characterizing with a Pin diode 184 7. 1.2 On-Wafer Noise Sources 8.6.6 What to Do with the Unused Package Pins 7.1.3 Faraday Shielding 147 8.7 Modeling a Package Mounted to a Carrier 7.2 High-Power RF Testing 8.7.1 Ground Inductance 187 7.3 Characterizing over Temperature 150 8.7.2 Ground Paddle 7.3.1 Heating the Wafe 152 8.8 Designing the Interconnecting Lines on the Carrier 191 7.3.2 Cryogenic Cooling 152 88.1 CPW or Microstrip 191 74 Summary 154 8.8.2 CPW or CBCPw 192 References 8.9 Quantifying the RF Effect of the Package on the Dle Package Characterization 157 8.9.1 Effective Relative Dielectric Constant E 193 8.9.2 Propagation Constant y and Characteristic Designing a Test Fixture for Package Characterization 158 Impedance Z 193 8.1.1 RF Launchers 158 8.9.3 Loss Tangent tand 195 8. 1.2 Coplanar Probes as RF Launchers 8.10 Package Style 196 8. 1.3 Test Fixture Body 159 8.10.1 Plastic Surface Mount Packages 8. 2 The Carrier 161 8.10.2 Flip-Chip 196 8.2.1 Designing the Carrier 8.10. 3 Bumped Chip Carrier 199 8.2.2 Carrier Board Material 164 8.11 Summary 200 Attaching the Package to the carrier 165 References 200 8.3.1 Bond Wires 165 8.3.2 Conductive adhesives Future Trends 205 84 Calibration 9.1 The Typical Design Cycle 205 8.4.1 Partitioning by Reference planes 172 9. 2 The Separate Worlds of Digital and RF 206 De-embedding the Fixture from the Measurement 174 9.3 The Goal: The Marriage of Digital and RF 8.5.1 De-embedding by Using a Thru line 175 into a single wireless product 207 RF Measurements of Die and Packages 9.4 New Substrate materials 208 9. The Direction of RF Development 209 9.6 The Future of the RF Test 210 9.7 Summary 2 Refo About the author Index 215 Preface In the early days, S-parameters were measured with a six-port reflectometer constructcd entirely of components found in the lab [1]. In assembling the reflectometer, the engineer strove to locate connectors that produced little reflection and couplers with excellent directivity. The reflectometer's para- sitic effects were de-cmbedded from the final measurement using pencil and d ble measurements of extremely large and small impedances were a challenge. The advent of the automated vector network analyzer(vna) alleviated the bulk of these problems. At the same time, a reliable vNa provided for the development of accurate RF probing tools. This book explains how d test fixtures to characterize radio fre integrated circuits(RFICs)and monolithic microwave integrated circuits (MMICs). The growth of the Rf wireless market along with digital integrated cir- cuits of clock speeds >1 GHz have created a solid need for this introductory book. To correct for nonidealities in the test system, both coplanar probes and test fixtures must be calibrated(Chapter 2). RE on-wafer probes are explored in detail, both coplanar probes used in the lab( Chapter 3)and membrane probes used in high-volume testing( Chapter 4). Chapter 5 covers test fixtures, the alternative approach to on-wafer probing. The most intri- cate task for coplanar probes, on-wafer device characterization, is described in Chapter 6, while a description of the complete RF test system is given in RF Measurements of Die and Packages hapter 7. Since most die are sold as packaged components, Chapter 8 pro- vides an understanding of how to RF-characterize the die's package The reader is encouraged to send corrections, criticisms, and sugges tions to either Artech House or myself. They will be incorporated into future editions. Thanks for your interest Reference LI] Engen, G, "A Review of the Six-Port Measurement Technique, "IEEE Microwave Sym- osium digest1997,pp.1171-1172. Acknowledgments I thank(in alphabetical order)Terry Burcham, Domingo Figueredo, Reed Gleason, Steve Hamilton, Troels Kolding, David Reid, Jeff Sinsky, Patrick Tang, and the staff at Artech House for their expert suggestions in preparing this manuscript. My utmost appreciation goes to my wife and three children, my company during evenings and weekends. This book is dedicated to them Introduction Put simply, the goal of this book is to enable the reader to go into th make better rF measurements. During the course of designing RFICs and MMICs, much revolves around the rf data. It is prescnted to the engineer ing staff to validate a computer-aided design. It is used to iterate integrated circuit(IC)mask layouts used by the foundry. It guides the designer's overall RF understanding. all of these directly impact the design' s cycle time and cost, and shortening this cycle is the surest way to product success. The beginning of this chapter introduces the topics covered in subse quent chapters. Chapters are ordered in a building-block fashion, with each hapter laying the foundation for the next. Understanding the basic com- position of an rF test system is the first building block. To this end the sec- ond part of this chapter details the essential elements in an rF test system The three fundamental elements are: the test system interface to the device- under-test(dut)(either coplanar probes or a test fixture); the VNA; and the connecting cables 1.1 Topics Covered in This Book 1.1.1 Calibration To ensure the validity of the measured data, the test equipment must be cali- brated. Calibration serves to quantify the degree of error in a test system Chapter 2 explains the errors found in an rF test system and how thcy can 2 RF Measurements of Die and Packages introduction be mathematically removed b Dy applying error models. Different methods of RF calibration are available, each based on measuring a set of standards in place of the DUT. At the end of Chapter 2, a list of common tips and trick Test Fixture VNA helps the reader put into practice the calibration concepts presented 1.12 Coplanar Probes Physically contacting the DUT, the coplanar probe becomes the final link in the rf test system to the wafer. Chapter 3 discusses the construction and RF characteristics of coplanar probes, beginning with coplanar waveguide the ory. Training in their proper use develops habits that enhance the probe's accuracy and lifetime. The configuration of the coplanar probe depends on the die's layout of its probe pads, as well as the die s RF function. The coplanar probe has its own unique set of calibration standards. Chapter 3 examines the electrical issues to consider when using and designing these Another style of RF probe, the membrane probe, is well suited for high- volume testing and is discussed in Chapter 4 Figure 1.1 An RF test fixture and vNA for measuring packaged devices 1.1.3 High-Volume Probing High-volume RF cesting is the domain of manufacturing assembly. Issues surrounding high-volume testing are distinct from those in the lab, where No crosstalk between the fixture s input and output ports individual die are manually probed one at a time. Test speed is the central Fast, easy, repeatable connections issue driving the design of manufacturing test systems and, to some degree, the design of the product. Chapter 4 describes a typical high-volume test setup, focusing on the membrane probe. Analogous to the coplanar probe, In practice, each of these points are met by the following the membrane probe is the RF interface from the test system to the dUt. Because of the speed of the die moving through the RF test system, unique Keeping the fixture's amount of loss and phase errors < the systems measurement uncertainty Making sure the dut bandwidth < fixture bandwidth 1.1.4 Test Fixtures The characteristic impedance Z of the test system= the test fixture Typically the final product is not a bare die but one that has been wire- Z=the dut zo; bonded and packaged. For packaged die, the best re interface to the test sys tem is a test fixture [1](see Figure 1. 1). The ideal test fixture has [2] the fol- The test fixture crosstalk <s the DUt's loss or isolation; lowing characteristics The measurement repeatability < the margin of the DUt test specifications No loss and no electrical length Flat frequency response; Chapter 5 covers how to design an RF test fixture. In particular, it di Perfect impedance match between the test system and DUt ports cusses the parasitic effects of the fixture on the DUT, as well as a detailed 【实例截图】
【核心代码】
RF Measurement of Die and Package good book for RF calibration and Debedding
Library of Congress Cataloging-in-Publication Data Wartenberg, Scott A. RF measurements of die and packages/ Scott A. Wartenberg Includes bibliographical references and inder: ry) cm (Artech House microwave librar ISBN 1-58053-273-x(alk. paper) 1. Very high speed integrated circuits-Measurements. 2. Integrated circuits -Masks--Design and construction. 3. Microelectronic packaging. 4. Radio measurements. I. Title TK787±.7.W372002 6213815dc21 2002016431 Contents British Library Cataloguing in Publication Data Wartenberg, Scott A RF measurements of die and packages.--(Artech House microwave library 1. Integrated circuits--Testing 2 Radio circuits--Testing 3 Preface ( Electronic instruments) Reference I. title 6213815 Acknowledgments ISBN1-58053-273x Introduction Cover design by Yekaterina Ratner Topics covered in This book 1.1.1 Calibration 1.1.2 Coplanar Probes 1.1.3 High-Volume Probing C 2002 ARTECH HOUSE, ING 685 Canton Street 1. 14 Test fixtures Norwood, MA 02062 1. 1. 5 On-Wafer Characterization 1.1.6 RF Test Systems rights reserved. Printed and bound in the United States of America. No part of this book 1.1.7 Package Charactcrization 2224444 may be reproduced or utilized in any form or by any means, electronic or mechanical, in- cluding photocopying, recording, or by any information storage and retrieval system, with Components of an RF Test System out permission in writing from the publisher 1.2.1 VNA All terms mentioned in this book that are known to be trademarks or service marks have been appropriately capitalized. Artech House cannot attest to the accuracy of this informa 1. 2.2 LCR Meter 4.57 tion. Use of a term in this book should not be regarded as affecting the validity of any trade 1. 2.3 RF cables mark or service mark International Standard Book Number: 1-58053-273 Library of Congress Catalog Card Number: 2002016431 098765432 RF Measurements of Die and Packages C ontents 1. 2. 4 Bias Cables 2.6.5 LRRM 1.2.5 Bias Tccs 10 2.7. Verification RF Connectors 2.7.1 Verification Elements 4生 1.3.1 Connector Types 2.7.2 Verifying with a Reference or"Golden"Unit 45 1.3.2 Making the Connection 2.8 Isolation 45 1.3.3 Connector Carc 12 2.9 Traceabilit 1.4 RF Connector Adapters 12 2.10 Repeatability, Reproducibility, and accuracy 15 The probe station 12 2.11 Calibration Tips and Tricks 1. 6 Summary 13 References 2. 12 Summary 51 Calibration Coplanar Probes 55 2. 1 Test System Errors: Random or Systematic 15 3.1 Theory of CPW 2.2 Concept of a Reference Plane 16 32 Mechanical Construction Error models 17 3.3 quivalent circuit 58 2.3.1 Signal Flow Graph 9 2.3.2 Error Adapter 21 3.4 Characterizing a Coplanar Probe 2,4 Calibration standards 3.5 Using Coplanar Probes 2, 4.1 Calibration Coefficients 24 3.5.1 Planarization 2.4.2 Short 3.5.2 Alignment 2.4.3. Open 26 3.5.3Ska 2.4.4 Load 28 3.54Ce Cleaning 2.4.5 Thru 29 3.6 Probe Configurations 2.5 Improving the Standard 3.6. 1 Balanced 2.5.1 Offset Delay 31 3.6.2 Unbalanced 6666 2.5.2 Offset Loss 3.6.3 Differential 3.6. 4 Other Probe Configurations Calibration method 33 2,61 SOLT 35 Noncontact Probing 71 2.6.2 SOLR 37 3.8 Applications 72 2.6.3 TRL 38 3.8.1 Millimeter-Wave Probing 72 2.64 LRM 3.8.2 Impedance-Matching, Low-Impedance Probes RF Measurements of Die and Packages Contents Coplanar Probe Calibration Standards 52 RF Transitions 3.9.1 Alumina Calibration Substrate 5.2.1 Coaxial to Microstrip 100 3.9.2 On-Wafer Calibration Standards 76 5.2.2 CPW to Microstrip 102 3.9.3 Open: In the Air or on Open Pads 77 5.2.3 Rectangular Waveguide to CPW 3.9.4 More Design Tips 5.2.4 Rectangular Waveguide to Microstrip 104 3.9.5 Verification 5.2.5 Rectangular Waveguide to Coaxial 105 3.10 Summary 80 5.3 Defining the Reference Planes 105 References 80 5.4 Two-Tier Calibration 107 High-Volume Probing 5.5 Test Fixture Calibration 108 5.5.1 Calibration Standards: Coaxial Versus In-Fixture 108 4.1 High-Volume Test 5.5.2 Calibration Method 109 RF Probe Card 84 5.5.3 Calibration Phase Uncertainty 111 4.21· Load B oard 4.2.2 Probe board 5.6 Summary 112 References 112 4.2. 3 Contactor Membrane probe On-Wafer Characterization 115 4.3.1 Construction 6. 1 Conductive Versus Insulating Substrates 116 4.4 Designing Membrane Probes 4.4.1 Digital and RF Signals Probe Pads and Interconnecting lines 118 4.4.2 Grounding 90 De-embedding the pads and interconnects 118 4.5 Using Membrane Probes 6.3.1 Open 119 6.3.2 Open and Short 4.6 Calibration 6.3.3 Open, Short, and Thru 122 4.7 Summary 6.3.4 Two-Port nctwork with a thru References 93 6.3.5 Two Shorts, an Open, and a thru 124 6.3.6 Some points to Consider When De-embeddin 126 5 Test Fixtures 6.3.7 Should the Transistor Finger Metal Be De-embedded? 128 5.1 The Basic test fixture 95 6.3.8 Effect of Pad Parasitics on ft 129 5. 1.1 Qualities of a Good Test Fixture 97 6. 4 De-embedding pads for noise 131 5.1.2 Characterizing the Fixture's Parasitic Effects 5.1.3 Types of Fixtures: R&D or Manufacturing 98 6.5 Measuring High-Isolation Devices 5. 1.4 Fixturing for Passive Components 6.6 Characterizing vertical devices 136 5.1.5 Fixturing for Active Components 99 6.7 Characterizing Passive Components 138 RF Measurements of Die and Packages orient 6.8 Millimeter-Wave Characterization 138 6.5.2 Time-Domain analysis 176 69 140 8.5.3 How to Apply Time-Domain Techniques Summary References 141 8.6 Procedure for Characterizing a Packa 6.1 Cha 182 RF Test Systems 145 8.6.2 Characterizing with a Short 183 8.6.3 Characterizing with an Open 7.1 On-Wafer noise te 145 8.6.4 Cha with a load 183 7.1.1 Basic Concepts in Noise 145 8.6.5 Characterizing with a Pin diode 184 7. 1.2 On-Wafer Noise Sources 8.6.6 What to Do with the Unused Package Pins 7.1.3 Faraday Shielding 147 8.7 Modeling a Package Mounted to a Carrier 7.2 High-Power RF Testing 8.7.1 Ground Inductance 187 7.3 Characterizing over Temperature 150 8.7.2 Ground Paddle 7.3.1 Heating the Wafe 152 8.8 Designing the Interconnecting Lines on the Carrier 191 7.3.2 Cryogenic Cooling 152 88.1 CPW or Microstrip 191 74 Summary 154 8.8.2 CPW or CBCPw 192 References 8.9 Quantifying the RF Effect of the Package on the Dle Package Characterization 157 8.9.1 Effective Relative Dielectric Constant E 193 8.9.2 Propagation Constant y and Characteristic Designing a Test Fixture for Package Characterization 158 Impedance Z 193 8.1.1 RF Launchers 158 8.9.3 Loss Tangent tand 195 8. 1.2 Coplanar Probes as RF Launchers 8.10 Package Style 196 8. 1.3 Test Fixture Body 159 8.10.1 Plastic Surface Mount Packages 8. 2 The Carrier 161 8.10.2 Flip-Chip 196 8.2.1 Designing the Carrier 8.10. 3 Bumped Chip Carrier 199 8.2.2 Carrier Board Material 164 8.11 Summary 200 Attaching the Package to the carrier 165 References 200 8.3.1 Bond Wires 165 8.3.2 Conductive adhesives Future Trends 205 84 Calibration 9.1 The Typical Design Cycle 205 8.4.1 Partitioning by Reference planes 172 9. 2 The Separate Worlds of Digital and RF 206 De-embedding the Fixture from the Measurement 174 9.3 The Goal: The Marriage of Digital and RF 8.5.1 De-embedding by Using a Thru line 175 into a single wireless product 207 RF Measurements of Die and Packages 9.4 New Substrate materials 208 9. The Direction of RF Development 209 9.6 The Future of the RF Test 210 9.7 Summary 2 Refo About the author Index 215 Preface In the early days, S-parameters were measured with a six-port reflectometer constructcd entirely of components found in the lab [1]. In assembling the reflectometer, the engineer strove to locate connectors that produced little reflection and couplers with excellent directivity. The reflectometer's para- sitic effects were de-cmbedded from the final measurement using pencil and d ble measurements of extremely large and small impedances were a challenge. The advent of the automated vector network analyzer(vna) alleviated the bulk of these problems. At the same time, a reliable vNa provided for the development of accurate RF probing tools. This book explains how d test fixtures to characterize radio fre integrated circuits(RFICs)and monolithic microwave integrated circuits (MMICs). The growth of the Rf wireless market along with digital integrated cir- cuits of clock speeds >1 GHz have created a solid need for this introductory book. To correct for nonidealities in the test system, both coplanar probes and test fixtures must be calibrated(Chapter 2). RE on-wafer probes are explored in detail, both coplanar probes used in the lab( Chapter 3)and membrane probes used in high-volume testing( Chapter 4). Chapter 5 covers test fixtures, the alternative approach to on-wafer probing. The most intri- cate task for coplanar probes, on-wafer device characterization, is described in Chapter 6, while a description of the complete RF test system is given in RF Measurements of Die and Packages hapter 7. Since most die are sold as packaged components, Chapter 8 pro- vides an understanding of how to RF-characterize the die's package The reader is encouraged to send corrections, criticisms, and sugges tions to either Artech House or myself. They will be incorporated into future editions. Thanks for your interest Reference LI] Engen, G, "A Review of the Six-Port Measurement Technique, "IEEE Microwave Sym- osium digest1997,pp.1171-1172. Acknowledgments I thank(in alphabetical order)Terry Burcham, Domingo Figueredo, Reed Gleason, Steve Hamilton, Troels Kolding, David Reid, Jeff Sinsky, Patrick Tang, and the staff at Artech House for their expert suggestions in preparing this manuscript. My utmost appreciation goes to my wife and three children, my company during evenings and weekends. This book is dedicated to them Introduction Put simply, the goal of this book is to enable the reader to go into th make better rF measurements. During the course of designing RFICs and MMICs, much revolves around the rf data. It is prescnted to the engineer ing staff to validate a computer-aided design. It is used to iterate integrated circuit(IC)mask layouts used by the foundry. It guides the designer's overall RF understanding. all of these directly impact the design' s cycle time and cost, and shortening this cycle is the surest way to product success. The beginning of this chapter introduces the topics covered in subse quent chapters. Chapters are ordered in a building-block fashion, with each hapter laying the foundation for the next. Understanding the basic com- position of an rF test system is the first building block. To this end the sec- ond part of this chapter details the essential elements in an rF test system The three fundamental elements are: the test system interface to the device- under-test(dut)(either coplanar probes or a test fixture); the VNA; and the connecting cables 1.1 Topics Covered in This Book 1.1.1 Calibration To ensure the validity of the measured data, the test equipment must be cali- brated. Calibration serves to quantify the degree of error in a test system Chapter 2 explains the errors found in an rF test system and how thcy can 2 RF Measurements of Die and Packages introduction be mathematically removed b Dy applying error models. Different methods of RF calibration are available, each based on measuring a set of standards in place of the DUT. At the end of Chapter 2, a list of common tips and trick Test Fixture VNA helps the reader put into practice the calibration concepts presented 1.12 Coplanar Probes Physically contacting the DUT, the coplanar probe becomes the final link in the rf test system to the wafer. Chapter 3 discusses the construction and RF characteristics of coplanar probes, beginning with coplanar waveguide the ory. Training in their proper use develops habits that enhance the probe's accuracy and lifetime. The configuration of the coplanar probe depends on the die's layout of its probe pads, as well as the die s RF function. The coplanar probe has its own unique set of calibration standards. Chapter 3 examines the electrical issues to consider when using and designing these Another style of RF probe, the membrane probe, is well suited for high- volume testing and is discussed in Chapter 4 Figure 1.1 An RF test fixture and vNA for measuring packaged devices 1.1.3 High-Volume Probing High-volume RF cesting is the domain of manufacturing assembly. Issues surrounding high-volume testing are distinct from those in the lab, where No crosstalk between the fixture s input and output ports individual die are manually probed one at a time. Test speed is the central Fast, easy, repeatable connections issue driving the design of manufacturing test systems and, to some degree, the design of the product. Chapter 4 describes a typical high-volume test setup, focusing on the membrane probe. Analogous to the coplanar probe, In practice, each of these points are met by the following the membrane probe is the RF interface from the test system to the dUt. Because of the speed of the die moving through the RF test system, unique Keeping the fixture's amount of loss and phase errors < the systems measurement uncertainty Making sure the dut bandwidth < fixture bandwidth 1.1.4 Test Fixtures The characteristic impedance Z of the test system= the test fixture Typically the final product is not a bare die but one that has been wire- Z=the dut zo; bonded and packaged. For packaged die, the best re interface to the test sys tem is a test fixture [1](see Figure 1. 1). The ideal test fixture has [2] the fol- The test fixture crosstalk <s the DUt's loss or isolation; lowing characteristics The measurement repeatability < the margin of the DUt test specifications No loss and no electrical length Flat frequency response; Chapter 5 covers how to design an RF test fixture. In particular, it di Perfect impedance match between the test system and DUt ports cusses the parasitic effects of the fixture on the DUT, as well as a detailed 【实例截图】
【核心代码】
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