索尼 imx274 datesheet

【实例简介】
imx274 datesheet，可以对接Hi3519V101，4K，分享一下
SONY IMX274LQC-C Absolute Maximum Ratings Item Symbol Ratings Unit Supply voltage(Analog) 1 ADD 0.3to+3.3 V Supply voltage(Digital 1) -0.5to+2.0 Supply voltage(Digital 2) DDD2 0.5to+3.3 V Input voltage(Digital) 0.3toV。Dp+0.3 V Output voltage(Digital) -0.3toVD2+0.3 Guaranteed operating temperature TOPR -30to+75 °C Storage guarantee temperature T STG 30to+80 C Performance guarantee temperature TsPEC 10to+60 Recommended Operating Conditions Item Symbol Rating Supply voltage(Analog) VADD 2.8±0.1 Supply voltage(Digital 1) 1.2±0.1 V Supply voltage(Digital 2) 1.8±0.1 Input voltage(Digital) -0.1 to Vopp2+0.1 1 VADD: VDDSUB, VoDHCM, VoDHPX, VDDHDA, VDDHCP (2.8V power supply VDDD1: VDDLCN, VDDLSC1 to 2, VDDLPA, VDDLPL1, VoDLPL2 to 3. VDDLIF (1.2V power supply) VDDD2: VDDMIO, VDDMIF (1.8V power supply) SONY IMX274LQC-C USE RESTRICTION NOTICE This USE RESTRIC TION NOTICE (Notice )is for customers who are considering or currently using the image sensor products("Products")set forth in this specifications book. Sony Corporation Sony")may at any time, modify this Notice which will be available to you in the latest specifications book for the Products. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has its own use restriction notice on the Products, such a use restriction notice will additionally apply betweer ou and the subsidiary or distributor. You should consult a sales representative of the subsidiary or distributor of sony on such a use restriction notice when you consider using the Products Use restrictions The Products are intended for incorporation into such general electronic equipment as office products communication products, measurement products, and home electronics products in accordance with the terms and conditions set forth in this specifications book and otherwise notified by sony from time You should not use the Products for critical applications which may pose a life-or injury-threatening risk or are highly likely to cause significant property damage in the event of failure of the products. You should consult your sales representative beforehand when you consider using the products for such critical applications. In addition, you should not use the products in weapon or military equipment Sony disclaims and does not assume any liability and damages arising out of misuse improper use modification, use of the Products for the above-mentioned critical applications, weapon and military equipment, or any deviation from the requirements set forth in this specifications book lesign for Safety Sony is making continuous efforts to further improve the quality and reliability of the products however failure of a certain percentage of the products is inevitable. Therefore, you should take sufficient care to ensure the sate design of your products such as component redundancy, anti-contlagration features and features to prevent mIs-operation in order to avoid accidents resulting in injury or death fire or other social damage as a result of such failure Export Control If the Products are controlled items under the export control laws or regulations of various countries approval may be required for the export of the products under the said laws or regulations You should be responsible for compliance with the said laws or regulations No License Implied o The technical information shown in this specifications book is for your reference purposes only. the availability of this specifications book shall not be construed as giving any indication that sony and its censors will license any intellectual property rights in such information by any implication or otherwise Sony will not assume responsibility for any problems in connection with your use of such information or for any infringement of third-party rights due to the same. It is therefore your sole legal and financial responsibility to resolve any such problems and infringement Governing law This notice shall be governed by and construed in accordance with the laws of Japan, without reference to principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relating to this Notice shall be submitted to the exclusive jurisdiction of the Tokyo district Court in Japan as the court of first instance Other Applicable Terms and Conditions The terms and conditions in the Sony additional specifications, which will be made available to you when you order the Products, shall also be applicable to your use of the Products as well as to this specifications book. You should review those terms and conditions when you consider purchasing and/or using the Products General-0.0. 8 SONY IMX274LQC-C Contents Description--- Features Device structure Optical Black Array and Readout Scan Direction--- Absolute Maximum Ratings 2233 Recommended Operating Conditions--------------- USE RESTRICTION NOTICE Contents Optical Ce Pin Configuration------------------ Pin description------------------------- 458899 hen using csl-2 When using Sub-LVDS 12 10 Equivalent Circuit Diagram 15 Peripheral Circuit 19 System Outline When using CSl-2 When using Sub-LVDS Electrical Characteristics when using cs1-2--------------------------m--------------------------------- 2 1. DC Characteristics(CS1-2) a.8..4 Current Consumption and Gain Variable Range(CSl-2 Supply Voltage and l/O Voltage(CS1-2) 2. AC Characteristics(CS1-2 22 INCK, XCLR(CSl-2) 22 XHS, XVS(Output)(CSI-2) 22 IC Communication (CSI-2) 23 DMCKP/DMCKN, DMO(CSl-2 Electrical Characteristics When Using Sub-LVDs-------------------m-------------------------- 1. DC Characteristics(Sub-LVDs)…… Current Consumption and gain Variable Range sub-LVDS 24 Supply Voltage and l/o Voltage(Sub-LVDS LVDS Output DC Characteristics(Sub-LVDS 2. AC Characteristics ( Sub-LVDS)......... 25 INCK, XCLR, XVS(input), XHS (input)(Sub-LVDS 25 Serial Communication(Sub-LVDS) Sub-LVDS Output(Sub-LVDS) 26 Spectral Sensitivity Characteristics(CS1-2 and Sub-LVDS 27 Image Sensor Characteristics(CSl-2 and Sub-LVDS)- 28 1. Zone Definition of Image Sensor Characteristics 28 mage Sensor Characteristics Measurement Method(CSl-2 and Sub-LVDS) 1. Measurement conditions 2. Color Coding of this Image Sensor and Readout ..29 3. Definition of Standard Imaging Conditions 29 Setting Registers Using I"C Communication(When Using CSl-2 Description of Setting Registers When Using I C communication 31 Pin Connection of Serial Communication Operation Specifications When Using I"C Communication Register Communication Timing When Using I-C Communication 12C Communication Protocol 32 Register Write and Read 33 Single Read from Random Location 33 Single read from current location ; iidaiaii:;aaaa“ Sequential Read Starting from Random Location Sequential Read Starting from Current Location 34 Single Write to Random Location 35 Sequential Write Starting from Random Location 35 Register Value Reflection Timing to Output Data(CSl-2) 36 SONY IMX274LQC-C Setting Registers Using Serial Communication (When Using Sub-LVDS)------------- ---37 Setting Registers Using Serial Communication(Sub-LVDS) .37 Register Value Reflection Timing to Output Data( Sub-LVDS 38 Register Map… 39 1. Description of Register 2. Register Setting for Each Readout Drive Mode eadout Drive Modes( csl-2 and Sub-LVDS)--------------------- 55 1. Readout drive modes 55 2. Relationship between Arithmetic Processing and the Number of Output bits in Each Readout Drive Mode Image Data Output Format When Using CSI-2------------------------ --58 Frame Format (CSI-2) 58 Frame Structure(CSl-2 58 Embedded Data Line(CSl-2) 59 CSl-2 serial Output Setting(CSl-2) MIPI Transmitter(CSl-2) 62 Detailed Specification of Each Mode(CSl-2)--------------- 63 1. Horizontal/ Vertical Operation Period in Each Readout Drive Mode(CSl-2 2. Frame Rate Adjustment(CSl-2 3. Image Data Output Format CSl-2 65 Vertical Arbitrary Cropping Function(CSl-2) -69 Horizontal Arbitrary Cropping Function(CSl-2 72 Electronic Shutter Timing When Using CSI-2------ 74 1. SHR, SVR, SMD Setting When Using CSl-2 74 1-1. SHR, SVR Setting(CSl-2) 74 1-2. Electronic Shutter Drive Mode(Csl-2) 75 2. Integration Time in Each Readout Drive Mode and Mode Changes When Using CSl-2 76 2-1. Integration Time in Each Readout Drive Mode(CSl-2 76 2-2. Operation when Changing the Readout Drive Mode(CSl-2 77 2-3. Low Power Consumption Drive in Integration Time When Using Roll ing Shutter Operation(CSl-2) 78 Image Data Output Format When Using Sub-LVDS --79 1. Sync Signals and Data Output Timing(Sub-LVDS) ““ 79 2. Output Range of LVDS Output Data(Sub-LVDS) Detailed Specification of Each Mode(Sub-LVDS) 删m Horizontal/Vertical Operation Period in Each Readout Drive Mode(sub-LVDs).......... 2. Frame Rate Adjus咖ment(Sub-LVDS)…… 3. Image Data Output Format ( Sub-LVDS) Vertical Arbitrary Cropping(Sub-LVDS) Horizontal arbitrary cropping function(Sub-LVDS)---- m94 Electronic Shutter Timing When Using Sub-LVDS 96 1. SHR, SVR Setting(Sub-LVDS)... 96 2. SVR Operation (Sub-LVDS 3. Electronic Shutter Drive Mode( Sub-LVDS) 97 4. Integration Time in Each Readout Drive Mode and mode changes When Using Sub-LVDS 98 4-1. Integration Time in Each Readout Drive Mode(Sub-LVDS 98 4-2. Operation when Changing the Readout Drive Mode(Sub-LVDS 99 4-3. Recommended Global Reset Shutter Operation Sequence(Sub-LVDS) 100 4-4. Interruptive Mode Change(Sub-LVDS 4-5. Low Power Consumption Drive in Exposure Time (Sub-LVDS) …102 Power-on/off Sequence when using CSI-2 ---103 1. Power-on Sequence(CS2)…… 103 2. Slew Rate Limitation of Power-on Sequence( CSI-2 103 3. Power-off Sequence(CSl-2 104 Standby cancel sequence when using csl-2-------------------------- 105 Power-on/off Sequence when using Sub-LVDS 116 1. Power-on Sequence(Sub-LVDS) 106 2. Slew Rate Limitation of Power-on Sequence(Sub-LVDS)......... 106 3. Power-off Sequence(Sub-LVDS) 107 Standby Cancel Sequence(Sub-LVDs)------------ 108 SONY IMX274LQC-C Spot Pixel specifications --109 Spot Pixel Zone Definition 109 Notice on White Pixels Specifications Measurement Method for Spot Pixels 111 1. Black or white pixels at high light 111 2. White pixels in the dark. 3. Black pixels at signal saturated 111 Spot Pixel Pattern Specifications----------------m--------------------------------------------------- 112 Stain Specifications ---113 Stain Zone definition 113 Stain Measurement method .113 Relation between Image height and target Cra----- Marking---------mm-------------- -115 Notes on Handling 116 Package outline --- 118 List of Trademark Logos and Definition Statements---------- ---119 SONY IMX274LQC-C Optical Center (Top View) Package outline 10.70±0.1mm PKG lpin M1 A1 Optical center M10 10 See page TBD Package Outl ine" for details Optical Center Pin Configuration Bottom View) lpin index 6666δ画δ尚画 ○● Bottom view Q§③¤¤意 ○○○○○○○○ 10 ○o⑦ A b C E F G M Pin configuration SONY IMX274LQC-C Pin Description When using CS1-2 Pin description State in Symbol O AD Remarks (CS|-2 Standby mode Leave open A2 TEST4 A Test (No connection A3 VDDHDa Power a Analog power supply (2.8V) A4 VDD SUB Power Analog power supply(2.8V A5 VDDLSC1 Power D Digital power supply(1.2v) A6 VssLSC1 GND D Digital GND(1.2V) A7 VDDLPL3 Power D Digital power supply (1.2 V) A8VDDLIF ower Digital power supply(1.2v) Leave open B1 TEST5 A Test (No connection B2 ssHDA GND A Analog GND (2.8V) B3 BIASRES Resister connection B4 /BGR Capacitor connection B5 GND D Digital GND (1 B6 XCLR Reset pulse input B7VssLPL3GND Digital GND (1.2V B8 VsSLIF1 GND D Digital GND (1.2V) B9 DMO4N Digital MiPl output Low Level Data lane 4 connection B10 DMO4P 。D Digital MIPl output Low Level Data lane 4 connection C1 TESt3 Test Leave open (No connection C2 XCE Cannect to 1.8 V power supply Leave open C3 TEST1 D (No connection C4 TEST2 est Leave open (No connection C5 VDDLPAPower D Digital power supply(1.2v) C6 VDDLPL2 Power D Digital power supply (1.2V) C7 VssLPL2 GND D Digital GND(1.2V) c9 DMO2N Digital MIPl output Low Level Data lane 2 connection Data lane 2 C10 DMO2P Digital MIPl output Low Level connection D1 XHS DDDD Horizontal sync signal output If unused xHs leave open D2 SDO lest output Low Leve/ Leave open No connection Vertical sync signal outpu f unusedⅩVS D leave open D9 DMCKN D Digital MIPl output Low Level Clock lane connection D10 DMCKP Digital MIPl output Low level Clock Lane connection E1 SCL DDD c communication clock input C communication data E2 SDA O input/output SONY IMX274LQC-C Pin Pin description Symbol AD State in Remarks No CS-2 Stand by mode E3 VSSLCB GND Digital GND(1.2 V) E8 VssLlF2 GND Digital GND(1.2 V) E9 DMO1N E10 DMO1P O F VDDLSC2 Power F2 VssLSC3 Power DDDDDDAD Data lane 1 Digital MIPl output Low Level connection Data lane 1 Digital MIPI output Low Level connection Digital power supply (1.2 V) Digital power supply (1.2 v) F3 VopHCM Power Analog power supply(2.8 V) F8 INCK Input clock DMO3N Digital MIPl output Data lane 3 Low Level connection F10 DMO3P Data lane 3 Digital MIPI output Low Level connection G3 VssHCP GND A Analog GND (2.8V) G8VssLSC2 GND D Digital GND(1.2V) G9 VssMIF2 GND D Digital GND (1.8V G10 VoDMIF Power D Digital power supply (1.8V) H1 VDDLCN GND D Digital GND(1.2V) VsSLCN GND Digital GND (1.2 V H3 VopHCP Power Analog power supply(2.8V DLO2P ( Pin for Sub-LVDS) Leave open (No connection H9 DLO2M 000 (Pin for Sub-LVDS) Leave open (No connecti H10 DLOOP (Pin for Sub-LVDS) Leave open (No connection) VssHPX3 GND A Analog GND(2.8 V) J3 VoDHPX Power DLO3P ADDDAADD Analog power supply(2.8 V) (Pin for Sub-LVDS) Leave open (No connection DLO3M O00 (Pin for Sub-LVDS) Leave open (No connection) J10 DLOOM D(Pin for Sub-LVDS) eave open (No connection) K2 VssLPL 1 GND D Digital GND(1.2V) K3 VDDLPL1 Power D Digital power supply(1.2V) K4 VoDMIO Power D Digital power supply(1.8V) K5 DLO1M (Pin for Sub-LVDS) Leave open (No connection DLCKM 0b「 (Pin for Sub-LVDS) Leave open (No connection) Leave open K7 DLCKP D(Pin for Sub-LVDS (No connection Leave open K8 DLO9P D (Pin for Sub-LVDS) (No connection Leave open K9 DLO9M (Pin for Sub-LVDS) (No connection K10 DLO5P (Pin for Sub-LVDS) Leave open No connection 【实例截图】
【核心代码】