microTCA规范

【实例简介】
PICMG microTCA.0 Specification RC1.0
Contents Introduction and objectives 1.1 Overview 1.2 Introduction 1.2.1S 1.2.2 MicroTCa implementation options 1画 1-2 1.2.3 Design goals 1-2 1.2.4 Elements of microtca 1-3 12.5 Theory of operation…… 着1国面1面日正 1-8 1.3 Micro TCA enclosure types 19 1.3.1 Single Shelf implementation 19 1.3.2 TWo Tier mⅸ ed Width Shelf implementation.…….….….….….….….…....1-10 1.3.3 Two-Tier fixed Single Width Shelf implementation ....................1-10 1.3.4 Back-to-Back Shelf implementation .1-10 1.3.5 Cube Shelf implementation ..1-10 1.3.6 Pico Shelf implementations 111 1.3.7 Other implementation options 111 1.4 Application examples 1-11 14.1 Base station… 1-11 1.42 Router 1-12 1.4.3∨ olP node.…. 1-12 1.4.4 Other Telecom Network applications E画 1-12 1.4.5 Enterprise applications 1-13 1.4.6 Other applications..... 1-13 1.4.7 Consumer applications 1-13 1.5 Special word usage 1-13 1.6 Conformance 1-14 1.7 Dimensions 1-14 1.8 Regulatory guidelines 1-14 1.9 Reference specifications 1.10 MicroTCA0 Specification contributor…… 1-15 1-16 1.11 Name and logo usage 1-16 1.12 Intellectual property…… 1-17 1.12.1 Necessary claims 1,,面,国国,,国面正 ∴1-18 1.12.2 Unnecessary claims 1118 1.12. 3 Third party disclosures 1-18 1.13 Glossary 1-19 2 Mechanical 2-1 2.1 Mechanical overview∴………… .2-1 2.1.1 Terminology… 2-2 2.1.2 Typical arrangement examples 2-2 2.2 Dimensions, tolerances, drawing symbols, and nomenclature 2-6 2.3 Mechanical concept 2-8 2.4 AdvancedMC Module orientation, location, and positioning 2-16 24.1 Module orientation .2-16 2.4.2 Module positioning, horizontal--mandatory 2-17 2.4.3 Module positioning, vertical-mandatory U.88 2-19 2. 4. 4 Module positioning, depth--mandatory ,.4 2-21 PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006 Do not specify or claim compliance with this Draft Specification 2.5 Slot detail dimensions 2-22 2.5.1S|ot.. 2-22 2.5.2 Slot configurations, subdividing Slots 2-22 2.5.3 Card guide, Strut, and Card Guide Support Plate(CGSP)…………223 2.5.4 Optional Subrack attachment plane 2-32 2.5.5 AdvancedMC Module--optional locking………………………2-34 2.6 Backplane 2-36 27 Subrack dimensions 2-41 2.7.1 Mandatory Subrack 2-42 2.8 Shelf 2-47 2.8. 1 Shelf types .2-48 2.8.2 Shelf width and height…...… 2-49 2.8.3 Shelf depth 2-49 2.8.4 Air filter provision 2-50 2.8.5 ESD wrist strap interface 2-50 2.8.6 Shelf alarm LEDs 2-51 2.9 Cable management 2-52 2. 10 Power entry /Power Module 2-56 2.10.1 Power Module pcb dimensions 2-58 2.10.2 Power Module component height 1·面 2-63 2.10.3 Power module face plate 2-64 2.10. 4 Power Module handle/Latch mechanism .267 2.10.5 Power module lEDs 2-67 2. 10.6 Power Module EMc gasketing 2-67 2.10.7 Power Module satety covers 2-67 2.10 8 Power module labels 2-68 2.10. 9 Power Module Backplane Connector 2-68 2.11 MCH Module 2-69 2.11.1 Module types 2-69 2.11.2 MCH PCB dimensions .2-70 2.11.3 MCH Subrack slot details 2-77 2.11. 4 Plug Connector. 2-79 2.11.5 Sequencing and contact area 2-81 2.11.6 MCH positioning 2-81 2. 12 Air flow management 面 2-82 2.13 Auxiliary Connector(Zone 2 and zone 3)keying 2-83 2.13.1 Component keep- in height 2-84 2.13.2 Connector keep-in height 2-84 2.133 Keying block… 2-85 2.13.5 AMC0 electrically compatible keying block 2.13. 4 Keying block with electrical connections 2-86 .2-87 2.14 MicroTCa cube 289 2.15 MicroTCA Pico 2.16 Microtca filler pane的∵ 面1面面,面 2-90 2-90 2.17 Cooling Units(CUs) 2-91 2.18 Subrack/Shelf/Cube/Pico performance .292 2. 18.1 Load carrying 2-92 2.18.2 Insertion cycles 292 2.18.3ESD 2-92 2.18.4EMC 2-93 PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006 Do not specify or claim compliance with this Draft Specification 2. 18.5 Safety 2-93 2.18.6 Physical Slot and Tier numbering 293 2.19 Subrack/Shelf environmental 2-96 2.19. 1 Subrack shock and vibration 2-96 2.19.2 Earthquake......... 2-96 2.19.3 Flammability 2-96 2.19.4 Atmospheric 2-96 2. 19.5 Thermal 2-97 2.19.6 Acoustic∴………………… 297 2.19.7 Surface temperatures 2-97 2.20 References 2-97 3 Hardware platform management 3-1 3.1 Overview 3.1.1 Micro Tca Carrier model 3-1 3.1.3 Relationship with IPMI, AdvancedMC, and AdvancedTCA. 3.1.2 MicroTCA management architecture 3-2 3-7 3.1.4 Key differences from PICMG 3.0 and AMC.0 specifications..........3-7 3.1.5 PICMG properties and FRU Device ID assignments 3-9 3.2 Management-related interconnects 3-11 3.2.1 AdvancedMc interconnects 3-11 3.2.2 Power Module and Cooling Unit interconnects 3.2.3 Guidelines for OEM Module interconnects and management 3-13 3-14 3.2.4 Carrier FRU Information device requirements .3-15 3.25 Microtca carrier interconnects 3-19 3.3 Carrier Manager.…….…..…...… 3-20 3.3.1 MCH Face Plate indicators 3-22 3.3.2 Payload Interface 3-22 3.3.3 Carrier Manager IP address 3-22 3.3.4 IPM event support ∴3-24 3.3.5 Redundant MCH operation 3-25 3.3.6 Addressing 3-26 3.3.7 Carrier number 3-29 3.3.8 Location information 34 Shelf Manager… 3-38 3. 4.1 Shelf Manager configuration options 38 3.4.2 Differences from the AdvancedTca shelf Manager 3-40 3.4.3 Shelf-Carrier Manager Interface 翻套国画1面,国面,1面D国画面国 3-42 3.4.4 Shelf Manager IP addre 3-43 3.5 MCMC requirements 345 3.6 EMMC requirements 3-46 3.7 Operational state management 3-48 3.7.1 Carrier Manager start up……….….….….………..……348 3.7.2 Shelf Manager actions on Carrier detection 3-48 3.7.3 Normal Shelf operation 1B面面国B 3-48 3.7.4 Abnormal situation handling 3-49 38 Power management.… …3-49 3.8.1 Power c lapping 国面 3-50 3.8.2 Micro T CA Carrier Power Management records .3-51 3.8.3 Early power management 356 PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006 Do not specify or claim compliance with this Draft Specification 3.8.4 Normal power management .3-57 3.8.5 Power management commands and sensors 3-59 3.8.6 Abnormal power condition handling 3-67 3.9 Cooling management 3-69 3.9.1 Fan geography.… 3-70 3.9.2 Cooling control …3-71 3.9.3 Normal cooling operation 3-72 3.9.4 Abnormal cooling operation 3-73 3.9.5 Fan tachometer sensors 3-73 3.9.6 Temperature sensors 翻画1国 翻B1B …3-73 3.10 Electronic Keying 3-74 3.10.1 Micro TCA Carrier point-to-point connectivity information 3-75 3.10.2 Module point-to-point connectivity information .3-77 3.10.3 AMC Port state commands 3-78 3.10.4 Clock b- Keying…… 3-78 3.11 Telco alarm management 3-7 3. 12 System Event log …………3-86 3.13 Sensor management 3-86 3.13.1 Guidelines and requirements for fru sensor events 3-86 3.13.2 MCMC SDR requirements .3-87 3.13.3 EMMC SDR requirements 3-88 3.13.4 Carrier Manager SDR requirements 3-88 3.14 fru Information .3-91 3. 14.1 EMMC FRU Information 3-91 3. 14.2 MCMC FRU Information 3-91 3.143 Carrier FRu Information 3-92 3. 14.4 Shelf fru information 面国面国面 3-92 3.15 PMI message bridging……… .3-93 3.15.1 Message bridging process 3-93 3.16 PMI functions and command 3-94 3. 16.1 Required IPMI functions ..3-95 3.16.2 Command assignments 3-97 3.17 FRU records, sensors and entity Ids ∴3-108 4 Power …4-1 4.1 Overview 4-1 4.2 Loads on the Power Subsystem 4-2 4.2.1 Microtca carrier hub(MCH),………,………………………24-2 4.2.2 Cooling Units 4-7 4.2.3 Advanced mezzanine cards 4-10 4.3 Power architecture 4-13 4.3.1 Basic functionality 4-13 4.3.2 Partitioning of the Power Subsystem :.::a: .4-15 4.3.3 Power sources 4-15 4.3. 4 Power Subsystem redundancy 4-16 4.3.5 System Grounding considerations 4-21 4.3.6 Power distribution and backplane considerations 4-23 4.4 Control and monitoring of the Power Subsystem 4-24 44.1 PM-EMMCs 4-24 4.4.2 Geographic Address 4-24 PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006 Do not specify or claim compliance with this Draft Specification 4.4.3|PMB-0 4-24 44.4Ps1[S|o# 4-25 4.4.5EN[Slof]#,… 4-25 44.6 PWRON_[Sot]… 4-25 4.4.7PSPM# 4-26 44.8 PM-EMMC watchdog timer…… 426 4.4.9 Power Module oK 4-27 44.10 Power module reset 4-27 4.4.11 System power-up 4-27 4.4.12 Input voltage sensors 1国面面量面1国面 4-29 4.4.13 Temperature sensors 4-29 4414 Power module extraction switch 4-30 4,415 Blue lED 4-30 4.4.16LED1 4-31 4 4.17 Other leds 4-31 4.5 Connectors 4-31 4.5. 1 Power Module Output Connector 4-32 4.5.2 Power Module Input Connectors 81国面面 4-32 4.6 Single-Width,Fu‖- Height Power Module… ∴4-33 4.6.1 Inputs 4-34 4.6.2 Outputs 4-35 4.6.3 Bulk supply current limit 4-38 4.6.4 Control and monitoring……………………… 4-38 4.6.5 Redundancy 4-38 4.6.6 Mechanical 4-45 46.7 Thermals .8...8.88.8 4-45 画·面 4.6.8 Regulatory. 4-45 47 Other mechanical considerations …4-46 4.7.1 Double-Width form factor 4-46 4.7.2 Form factors other than Full-Height 4-46 4.8 Power source considerations .4-46 4.8.1 DC power feeds 4-47 4.8.2 AC power feeds 4-55 4.9 References 4-60 5 Thermal 5.1 Overview 5-1 5.2 AMC. 0 Modules and microtCa 国着画 5-1 5.3 AMC.0 Carriers and microtca 5.4 Subrack slot 5-2 5.5 Airflow path 5.6 AMC.0 Modules and power dissipation .5-3 5-3 5.7 MicroTCA system cooling configuration……….….….…... .54 5. 8 Air distribution in a slot 5-4 5.9 Air inlet and exhaust 5-5 5. 10 Slot cooling capability 5-5 5. 11 Module cooling requirements ● 5.12 Standard air .5-7 5.12.1 Derivatie 5.122 Barometric changes due to weather....…...……….57 PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006 Do not specify or claim compliance with this Draft Specification 5.13 Slot impedance curve .5-8 5.14 Slot fan flow curve 5.15 Cooling Unit failure 5-8 5.16 Filters 5.17 System sensors….…….….…… 5-9 5.18 Thermal and operating environment 5-10 5.19 Thermal and cabling 5-10 5.20 Simulation and impedance testing 5-10 5.20.1 AdvancedMC/MCH reference Module ..5-11 5.20.2 Power Unit reference module ∴5-12 5.21 Simulation environment 5.22 Thermal dynamic modeling 5-13 5.23 Fluid networking modeling 5.24 Acoustic noise 5-13 5.25 Surface temperature 5-14 5.26 Design recommendations 5-15 5.27 Cooling limitations and examples ..5-17 5.28 References 1面 5-22 6 Interconnect 6-1 6.1 Introduction.… 6-1 6.2 Fabric interface 6.2.1 Backplane fabric interface support requirements 6-2 6.2.2 MCH fabric interface support requirements 6.3 MCH Specific Interfaces 6-4 6.3.1 MCH update Channel interface 6-4 6.3.2 MCH cross-over Channel interface .6-5 6. 3. 3 MCH PWR ON interface 6-6 6.3.4 Inter-MCH IPMB-L interface 6.4 Synchronization clock interface 6.4.1 Signal descriptions 6-8 6. 4.2 Clock architectures 6-9 6.4.3 Non-Telecom and Telecom clocks 6-13 6.5 JTAG interface.… 6-13 6.5.1 JSM Overview 6-14 6.5.2 JSM Signaling Overview 6-16 6.5.3 JSM Interface to mch1 6.54 JSM Interface to mch2.……6-18 6.5.5 JSM Interface to Advancedmcs .6-19 6.5.6 JSM Interface to Power modules .6-22 6.5.7 JSM Master mode selection 6-23 6.5.8 JSM Interface to External tester ..6-24 6.5.9 MCH JTAG 6-26 6.5. 10 Power module jtAG 6-27 6.6 MicroTCA Interface topologies 1画 6-27 6.6. 1 Topology models 6-28 6.6.2 Correlation to AdvancedMc fabric regions 6-29 6.7 MCH Connector pin allocation 6-30 6.7.1 Pin naming conventions 6-31 6.7.2 Fabric interface naming conventions 6-31 PICMG MicroTCA. 0 Specification Draft RC1.o, May 26, 2006 Do not specify or claim compliance with this Draft Specification 6.7.3 Synchronization clock interface naming convention 6-31 6.7.4 MCH Connector pin list…………… 6-32 6.8 System examples .6-38 6.8. 1 Redundant MicroTCA system 6-38 6.8.2 Variant redundant microtca interconnect 6-41 6.8.3 Non-redundant MicroTCA system 6-45 Connectors 7-1 7.1 General information 7-1 7.2 AdvancedMC Backplane Connectors 7-1 7.2.1 AdvancedMC Backplane Connector pin list 7-2 7.2.2 AdvancedMC Backplane Connector dimensions 7-2 7.2.3 Advancedmc backplane connector pcb layout ∴7-6 7. 2. 4 AdvancedMC Backplane Connector electrical characteristics 7-10 7.2.5 AdvancedMC Backplane Connector high-speed characteristics 7-14 7.2.6 AdvancedMC Backplane Connector mechanical characteristics 7-18 7.3 Micro TCa Carrier hub connectors 7-19 7.3.1 Micro TCA Carrier Hub Connector pin list 7-19 7.3.2 Micro TCA Carrier Hub mating interface design 7-20 7.3.3 Micro TCA Carrier Hub backplane connector 7-22 7.3. 4 Micro TCA Carrier Hub Connector Backplane PCB layout 7-23 7. 3.5 Micro tca Carrier Hub connector electrical characteristics 7-24 7.3.6 Micro TCA Carrier Hub Connector high-speed characteristics 7-25 73.7 Micro tCa Carrier hub connector mechanical characteristics 7-29 7.4 Power Module Output Connector 7.4.1 Power Module Output Connector pin list and mating sequence 7-31 7.4.2 Power Module Output Connector dimensions 7-32 7. 4.3 Power Module Output Connector Backplane PCb layout 7-34 7.4.4 Electrical characteristics for power Module output connector .7-36 7.4.5 Power Module Output Connector mechanical characteristics 7-39 7.5 Power Module Input Connector 7.5.1 Power Module Input Connector pin list and mating sequence 7-41 7.5.2 Power Module Input Connector dimensions 7-42 7.5.3 Electrical characteristics for Power Module Input Connector 7-47 7.5.4 Power Module Input Connector mechanical characteristics 7-51 7.6 AdvancedMC Auxiliary Connector 7-53 7.7 Test schedule 7-54 7.7.1 Specimen measurement arrangements 7-54 7.7.2 Test schedule tables .7-64 7. 8 References .7-79 8 Regulatory requirements and industry standard guidelines 8-1 8.1 Regulatory…… 8-1 8.1.1 Safety 8-1 8.1.2 Electromagnetic compatibility..……………8-2 8.1.3 Ecology standards .8-2 8.2 Telecommunications industry standards requirements 8-3 8. 2. 1 EMC/safety requirements for the telecommunications industry.......8-3 8.2.2 Environmental requirements for the telecommunications industry ..............8-4 8.3 Reliability/MTBF standards 8-7 PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006 Do not specify or claim compliance with this Draft Specification 8.4 Cross reference list 8.5 FRU test guidelines ∴8-7 8.5. 1 FRU safety test 8-8 8.5.2 FRU EMC testing .8-8 8.5.3 FRU environmental testing 8-9 a Module mis-insertion considerations A-1 A 1 MCH Module mis-insertion combinations A-2 A 2 AdvancedMc module mis-insertion combinations A-5 A3 Power management implications A-8 A 4 System management implications A-8 A.4.1 Optional MMC instance on MCH Module A-9 A.4.2 Using an AdvancedMC in an MCH Slot A-13 A.4.3 Using an mch in an AdvancedMc Slot A-15 A.4.4 Detecting mis-insertions A-16 A.5 Hardware implications A-1 A. 5. 1 GNd pins at same locations........ A-20 A.5.2 PSO# and PS1# pins at same locations A-23 A.5.3 PWR and MP pins at same locations A27 A.5. 4 PWR ON pin A-29 A.5.5 Ga[2: 0] pins at same locations 道1面4 …A-31 A.5.6 ENABLE# pin at same location A-35 A.5.7 SDA L and SCL L pins A-37 A 5.8 JTAG pins A-38 A 5.9 Cross-over pins A-39 A.5. 10 TMREQ#, 12C SDA, and I2C SCL pins …A-39 B Requirement list…. B-1 PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006 Do not specify or claim compliance with this Draft Specification 【实例截图】
【核心代码】