实例介绍
RK3308是一颗针对专门音频和IoT应用而设计的主控芯片，省去了GPU、视频编解码以及部分显示接口，增加了CODEC以及音频相关模块，不论是芯片成本还是系统成本都进行了优化，能实现高性价比的整体方案
【实例截图】
【核心代码】
Table of Content
Table of Content ...................................................................................................... 3
Figure Index ........................................................................................................... 4
Table Index ............................................................................................................. 5
Warranty Disclaimer ................................................................................................. 6
Chapter 1 Introduction ..................................................................................... 7
1.1 Overview ............................................................................................... 7
1.2 Features ................................................................................................ 7
1.3 Block Diagram ...................................................................................... 14
Chapter 2 Package Information......................................................................... 17
2.1 Order Information ................................................................................. 17
2.2 Top Marking ......................................................................................... 17
2.3 TFBGA355 Dimension ............................................................................ 17
2.4 Ball Map .............................................................................................. 21
2.5 Pin Number List .................................................................................... 29
2.6 Power/Ground IO Description .................................................................. 34
2.7 Function IO Description .......................................................................... 38
2.8 IO Pin Name Description ........................................................................ 60
2.9 IO Type ............................................................................................... 65
Chapter 3 Electrical Specification ...................................................................... 66
3.1 Absolute Ratings ................................................................................... 66
3.2 Recommended Operating Condition ......................................................... 66
3.3 DC Characteristics ................................................................................. 67
3.4 Electrical Characteristics for General IO .................................................... 68
3.5 Electrical Characteristics for PLL .............................................................. 68
3.6 Electrical Characteristics for USB 2.0 Interface .......................................... 68
3.7 Electrical Characteristics for TSADC.......................................................... 69
3.8 Electrical Characteristics for SARADC ....................................................... 69
3.9 Electrical Characteristics for Audio Codec .................................................. 70
Chapter 4 Thermal Management ....................................................................... 72
4.1 Overview ............................................................................................. 72
4.2 Package Thermal Characteristics ............................................................. 72
RK3308B-S Datasheet Rev 1.0
Copyright 2021© Rockchip Electronics Co., Ltd. - 4 -
Figure Index
Fig.1-1 RK3308B-S Block Diagram ......................................................................... 15
Fig.1-2 RK3308H-S Block Diagram ......................................................................... 16
Fig.2-1 RK3308B-S Package definition .................................................................... 17
Fig.2-2 RK3308H-S Package definition .................................................................... 17
Fig.2-3 RK3308B-S Package Top View and Side View................................................. 18
Fig.2-4 RK3308B-S Package bottom view ................................................................ 18
Fig.2-5 RK3308B-S Package dimension ................................................................... 19
Fig.2-6 RK3308H-S Package Top View and Side View ................................................ 19
Fig.2-7 RK3308H-S Package bottom view ................................................................ 20
Fig.2-8 RK3308H-S Package dimension ................................................................... 20
Fig.2-9 RK3308B-S Ball Map-1 ............................................................................... 21
Fig.2-10 RK3308B-S Ball Map-2 ............................................................................. 23
Fig.2-11 RK3308B-S Ball Map-3 ............................................................................. 23
Fig.2-12 RK3308B-S Ball Map-4 ............................................................................. 24
Fig.2-13 RK3308H-S Ball Map-1 ............................................................................. 25
Fig.2-14 RK3308H-S Ball Map-2 ............................................................................. 26
Fig.2-15 RK3308H-S Ball Map-3 ............................................................................. 27
Fig.2-16 RK3308H-S Ball Map-4 ............................................................................. 28
RK3308B-S Datasheet Rev 1.0
Copyright 2021© Rockchip Electronics Co., Ltd. - 5 -
Table Index
Table 2-1 RK3308B-S Pin Number List Information ................................................... 29
Table 2-2 RK3308B-S Power/Ground IO information .................................................. 34
Table 2-3 RK3308H-S Power/Ground IO information ................................................. 36
Table 2-4 RK3308B-S Function IO description .......................................................... 38
Table 2-5 RK3308H-S Function IO description .......................................................... 49
Table 2-6 IO function description list ....................................................................... 60
Table 2-7 IO Type List ........................................................................................... 65
Table 3-1 Absolute ratings ..................................................................................... 66
Table 3-2 Recommended operating condition ........................................................... 66
Table 3-3 DC Characteristics .................................................................................. 67
Table 3-4 Electrical Characteristics for Digital General IO ........................................... 68
Table 3-5 Electrical Characteristics for PLL ............................................................... 68
Table 3-6 Electrical Characteristics for USB 2.0 Interface ........................................... 68
Table 3-7 Electrical Characteristics for TSADC .......................................................... 69
Table 3-8 Electrical Characteristics for SARADC ........................................................ 69
Table 3-9 Electrical Characteristics for Audio Codec ................................................... 70
Table 4-1 RK3308B-S Thermal Resistance Characteristics .......................................... 72
Table 4-2 RK3308H-S Thermal Resistance Characteristics .......................................... 72
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