gd23f305DATASHEET：GigaDevice Semiconductor Inc.GD32F305xxARM ® Cortex ® -M4 32-bit MCU

【核心代码】

Table of Contents
Table of Contents ........................................................................................................... 1
List of Figures ................................................................................................................ 4
List of Tables .................................................................................................................. 5
1. General description ................................................................................................. 7
2. Device overview ....................................................................................................... 8
2.1. Device information ...................................................................................................... 8
2.2. Block diagram .............................................................................................................. 9
2.3. Pinouts and pin assignment ..................................................................................... 10
2.4. Memory map .............................................................................................................. 13
2.5. Clock tree ................................................................................................................... 17
2.6. Pin definitions ............................................................................................................ 18
2.6.1. GD32F305Zx LQFP144 pin definitions.................................................................. 18
2.6.2. GD32F305Vx LQFP100 pin definitions ................................................................. 27
2.6.3. GD32F305Rx LQFP64 pin definitions ................................................................... 34
3. Functional description .......................................................................................... 38
3.1. ARM ® Cortex ® -M4 core .............................................................................................. 38
3.2. On-chip memory ........................................................................................................ 38
3.3. Clock, reset and supply management ...................................................................... 39
3.4. Boot modes ................................................................................................................ 39
3.5. Power saving modes ................................................................................................. 40
3.6. Analog to digital converter (ADC) ............................................................................ 40
3.7. Digital to analog converter (DAC) ............................................................................. 41
3.8. DMA ............................................................................................................................ 41
3.9. General-purpose inputs/outputs (GPIOs) ................................................................ 41
3.10. Timers and PWM generation ................................................................................. 42
3.11. Real time clock (RTC) ............................................................................................ 43
3.12. Inter-integrated circuit (I2C) .................................................................................. 43
3.13. Serial peripheral interface (SPI) ............................................................................ 43
3.14. Universal synchronous asynchronous receiver transmitter (USART) ............... 44
3.15. Inter-IC sound (I2S) ................................................................................................ 44
 GD32F305xx Datasheet
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3.16. Universal serial bus full-speed interface (USBFS) ............................................... 44
3.17. Controller area network (CAN) .............................................................................. 45
3.18. External memory controller (EXMC) ..................................................................... 45
3.19. Debug mode ........................................................................................................... 45
3.20. Package and operation temperature ..................................................................... 46
4. Electrical characteristics ....................................................................................... 47
4.1. Absolute maximum ratings ....................................................................................... 47
4.2. Operating conditions characteristics ....................................................................... 47
4.3. Power consumption .................................................................................................. 49
4.4. EMC characteristics .................................................................................................. 56
4.5. Power supply supervisor characteristics ................................................................ 56
4.6. Electrical sensitivity .................................................................................................. 57
4.7. External clock characteristics .................................................................................. 58
4.8. Internal clock characteristics ................................................................................... 60
4.9. PLL characteristics.................................................................................................... 61
4.10. Memory characteristics ......................................................................................... 63
4.11. NRST pin characteristics ....................................................................................... 63
4.12. GPIO characteristics .............................................................................................. 64
4.13. ADC characteristics ............................................................................................... 65
4.14. Temperature sensor characteristics ..................................................................... 67
4.15. DAC characteristics ............................................................................................... 67
4.16. I2C characteristics ................................................................................................. 69
4.17. SPI characteristics ................................................................................................. 69
4.18. I2S characteristics.................................................................................................. 70
4.19. USART characteristics ........................................................................................... 70
4.20. CAN characteristics ............................................................................................... 71
4.21. USBFS characteristics ........................................................................................... 71
4.22. EXMC characteristics ............................................................................................. 72
4.23. TIMER characteristics ............................................................................................ 76
4.24. WDGT characteristics ............................................................................................ 76
4.25. Parameter conditions ............................................................................................. 76
5. Package information .............................................................................................. 77
 GD32F305xx Datasheet
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5.1. LQFP144 package outline dimensions ..................................................................... 77
5.2. LQFP100 package outline dimensions ..................................................................... 78
5.3. LQFP64 package outline dimensions....................................................................... 79
6. Ordering information ............................................................................................. 80
5. Revision history ..................................................................................................... 81