GD32F303xxA Datasheet_Rev1.0

【实例截图】

【核心代码】

Table of Contents
Table of Contents................................................................................................................. 1
List of Figures ...................................................................................................................... 4
List of Tables ........................................................................................................................ 5
1. General description ...................................................................................................... 7
2. Device overview ............................................................................................................ 8
2.1. Device information....................................................................................................... 8
2.2. Block diagram ............................................................................................................. 9
2.3. Pinouts and pin assignment ........................................................................................10
2.4. Memory map...............................................................................................................12
2.5. Clock tree ...................................................................................................................16
2.6. Pin definitions ............................................................................................................17
2.6.1. GD32F303VxA LQFP100 pin definitions .............................................................. 17
2.6.2. GD32F303RxA LQFP64 pin definitions................................................................ 24
2.6.3. GD32F303CxA LQFP48 pin definitions................................................................ 28
3. Functional description ............................................................................................... 31
3.1. Arm ® Cortex ® -M4 core .................................................................................................31
3.2. On-chip memory .........................................................................................................31
3.3. Clock, reset and supply management...........................................................................32
3.4. Boot modes ................................................................................................................32
3.5. Power saving modes ...................................................................................................33
3.6. Analog to digital converter (ADC).................................................................................33
3.7. Digital to analog converter (DAC).................................................................................34
3.8. DMA ...........................................................................................................................34
3.9. General-purpose inputs/outputs (GPIOs) ......................................................................34
3.10. Timers and PWM generation.....................................................................................35
3.11. Real time clock (RTC) ..............................................................................................36
3.12. Inter-integrated circuit (I2C)......................................................................................36
3.13. Serial peripheral interface (SPI) ................................................................................36
3.14. Universal synchronous asynchronous receiver transmitter (USART) ..........................37
3.15. Inter-IC sound (I2S) ..................................................................................................37
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3.16. Universal serial bus full-speed device interface (USBD) .............................................37
3.17. Controller area network (CAN) ..................................................................................38
3.18. Secure digital input and output card interface (SDIO).................................................38
3.19. External memory controller (EXMC) ..........................................................................38
3.20. Debug mode............................................................................................................39
3.21. Package and operation temperature .........................................................................39
4. Electrical characteristics ........................................................................................... 40
4.1. Absolute maximum ratings ..........................................................................................40
4.2. Operating conditions characteristics............................................................................40
4.3. Power consumption ....................................................................................................42
4.4. EMC characteristics ....................................................................................................50
4.5. Power supply supervisor characteristics ......................................................................51
4.6. Electrical sensitivity ....................................................................................................51
4.7. External clock characteristics ......................................................................................52
4.8. Internal clock characteristics .......................................................................................54
4.9. PLL characteristics .....................................................................................................56
4.10. Memory characteristics............................................................................................56
4.11. NRST pin characteristics..........................................................................................57
4.12. GPIO characteristics ................................................................................................58
4.13. ADC characteristics .................................................................................................59
4.14. Temperature sensor characteristics..........................................................................61
4.15. DAC characteristics .................................................................................................61
4.16. I2C characteristics ...................................................................................................62
4.17. SPI characteristics...................................................................................................63
4.18. I2S characteristics ...................................................................................................65
4.19. USART characteristics .............................................................................................67
4.20. SDIO characteristics ................................................................................................67
4.21. CAN characteristics .................................................................................................67
4.22. USBD characteristics ...............................................................................................68
4.23. EXMC characteristics...............................................................................................69
4.24. TIMER characteristics ..............................................................................................73
4.25. WDGT characteristics ..............................................................................................73
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4.26. Parameter conditions...............................................................................................73
5. Package information................................................................................................... 74
5.1. LQFP100 package outline dimensions..........................................................................74
5.2. LQFP64 package outline dimensions ...........................................................................76
5.3. LQFP48 package outline dimensions ...........................................................................78
5.4. Thermal characteristics ...............................................................................................80
6. Ordering information .................................................................................................. 82
7. Revision history .......................................................................................................... 83
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List of Figures
Figure 2-1. GD32F303xxA block diagram ................................................................................................................. 9
Figure 2-2. GD32F303Vx LQFP100 pinouts............................................................................................................ 10
Figure 2-3. GD32F303Rx LQFP64 pinouts.............................................................................................................. 11
Figure 2-4. GD32F303Cx LQFP48 pinouts.............................................................................................................. 11
Figure 2-5. GD32F303xxA clock tree........................................................................................................................ 16
Figure 4-1. Recommended power supply decoupling capacitors (1)(2) ........................................................... 41
Figure 4-2. Typical supply current consumption in Run mode (All peripherals enabled)..................... 47
Figure 4-3. Typical supply current consumption in Run mode (All peripherals disabled) ................... 47
Figure 4-4. Typical supply current consumption in Sleep mode (All peripherals enabled) ................. 48
Figure 4-5. Typical supply current consumption in Sleep mode (All peripherals disabled) ................ 48
Figure 4-6. Recommended external NRST pin circuit ........................................................................................ 57
Figure 4-7. I/O port AC characteristics definition ................................................................................................ 59
Figure 4-8. I2C bus timing diagram .......................................................................................................................... 63
Figure 4-9. SPI timing diagram - master mode ..................................................................................................... 64
Figure 4-10. SPI timing diagram - slave mode ...................................................................................................... 64
Figure 4-11. I2S timing diagram - master mode ................................................................................................... 66
Figure 4-12. I2S timing diagram - slave mode ...................................................................................................... 66
Figure 4-13. USBD timings: definition of data signal rise and fall time ....................................................... 68
Figure 5-1. LQFP100 package outline...................................................................................................................... 74
Figure 5-2. LQFP100 recommended footprint ...................................................................................................... 75
Figure 5-3. LQFP64 package outline ........................................................................................................................ 76
Figure 5-4. LQFP64 recommended footprint......................................................................................................... 77
Figure 5-5. LQFP48 package outline ........................................................................................................................ 78
Figure 5-6. LQFP48 recommended footprint......................................................................................................... 79
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List of Tables
Table 2-1. GD32F303xxA devices features and peripheral list ......................................................................... 8
Table 2-2. GD32F303xxA memory map ................................................................................................................... 12
Table 2-3. GD32F303Vx LQFP100 pin definitions ................................................................................................ 17
Table 2-4. GD32F303Rx LQFP64 pin definitions .................................................................................................. 24
Table 2-5. GD32F303Cx LQFP48 pin definitions .................................................................................................. 28
Table 4-1. Absolute maximum ratings (1) (4) ............................................................................................................ 40
Table 4-2. DC operating conditions .......................................................................................................................... 40
Table 4-3. Clock frequency (1) ....................................................................................................................................... 41
Table 4-4. Operating conditions at Power up/ Power down (1) ......................................................................... 41
Table 4-5. Start-up timings of Operating conditions (1)(2)(3) ................................................................................ 41
Table 4-6. Power saving mode wakeup timings characteristics (1)(2) .............................................................. 42
Table 4-7. Power consumption characteristics (2)(3)(4)(5) ....................................................................................... 42
Table 4-8. Peripheral current consumption characteristics (1) ......................................................................... 48
Table 4-9. EMS characteristics (1) ............................................................................................................................... 50
Table 4-10. Power supply supervisor characteristics ........................................................................................ 51
Table 4-11. ESD characteristics (1) .............................................................................................................................. 52
Table 4-12. Static latch-up characteristics (1) ......................................................................................................... 52
Table 4-13. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics.. 52
Table 4-14. High speed external clock characteristics (HXTAL in bypass mode).................................... 52
Table 4-15. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics ... 53
Table 4-16. Low speed external user clock characteristics (LXTAL in bypass mode) ........................... 54
Table 4-17. High speed internal clock (IRC8M) characteristics ...................................................................... 54
Table 4-18. Low speed internal clock (IRC40K) characteristics ..................................................................... 55
Table 4-19. High speed internal clock (IRC48M) characteristics.................................................................... 55
Table 4-20. PLL characteristics.................................................................................................................................. 56
Table 4-21. Flash memory characteristics ............................................................................................................. 56
Table 4-22. NRST pin characteristics....................................................................................................................... 57
Table 4-23. I/O port DC characteristics (1)(3) ............................................................................................................. 58
Table 4-24. I/O port AC characteristics (1)(2) ............................................................................................................. 58
Table 4-25. ADC characteristics ................................................................................................................................ 59
Table 4-26. ADC R AIN max for f ADC = 40 MHz .............................................................................................................. 60
Table 4-27. ADC dynamic accuracy at f ADC = 14 MHz (1) ...................................................................................... 60
Table 4-28. ADC dynamic accuracy at f ADC = 40 MHz (1) ...................................................................................... 60
Table 4-29. ADC static accuracy at f ADC = 14 MHz (1) ............................................................................................ 61
Table 4-30. Temperature sensor characteristics (1) .............................................................................................. 61
Table 4-31. DAC characteristics ................................................................................................................................ 61
Table 4-32. I2C characteristics (1)(2) ............................................................................................................................ 62
Table 4-33. Standard SPI characteristics (1) ............................................................................................................ 63
Table 4-34. I2S characteristics (1)(2) ............................................................................................................................. 65
Table 4-35. USART characteristics (1) ........................................................................................................................ 67
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Table 4-36. SDIO characteristics (1)(2) ......................................................................................................................... 67
Table 4-37. USBD start up time .................................................................................................................................. 68
Table 4-38. USBD DC electrical characteristics ................................................................................................... 68
Table 4-39. USBD full speed-electrical characteristics (1) .................................................................................. 68
Table 4-40. Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings (1)(2)(3) .............................. 69
Table 4-41. Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings (1)(2)(3) ............................. 69
Table 4-42. Asynchronous multiplexed PSRAM/NOR read timings (1)(2)(3) .................................................... 70
Table 4-43. Asynchronous multiplexed PSRAM/NOR write timings (1)(2)(3) ................................................... 70
Table 4-44. Synchronous multiplexed PSRAM/NOR read timings (1)(2)(3) ....................................................... 71
Table 4-45. Synchronous multiplexed PSRAM write timings (1)(2)(3) ................................................................ 71
Table 4-46. Synchronous non-multiplexed PSRAM/NOR read timings (1)(2)(3) .............................................. 72
Table 4-47. Synchronous non-multiplexed PSRAM write timings (1)(2)(3) ....................................................... 72
Table 4-48. TIMER characteristics (1) ......................................................................................................................... 73
Table 4-49. FWDGT min/max timeout period at 40 kHz (IRC40K) (1) ............................................................... 73
Table 4-50. WWDGT min-max timeout value at 60 MHz (f PCLK1 ) (1) ................................................................... 73
Table 5-1. LQFP100 package dimensions .............................................................................................................. 74
Table 5-2. LQFP64 package dimensions ................................................................................................................ 76
Table 5-3. LQFP48 package dimensions ................................................................................................................ 78
Table 5-4. Package thermal characteristics (1) ....................................................................................................... 80
Table 6-1. Part ordering code for GD32F303xxA devices ................................................................................. 82
Table 7-1. Revision history .......................................................................................................................................... 83